레이저 미세 홀 가공

ADVANTAGE

(1) Independent intellectual property rights of the control software, Humanized interface, complete

functions and simple operation. 

(2) Processing any graphic, cutting different thickness and different materials, stratified processing

and complete synchronously 

(3)Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak

power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to

cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise

cutting effects, smooth, steep sidewall. 

(4)Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the

processing efficiency. 

(5)Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc. 

(6) Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness

measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy,

reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.

Applicable materials

FR4, 3M glue, PI reinforcement, PP film PE and other auxiliary materials can also be used for cutting various,Base materials, such as ceramics, quartz, Wu copper, Teflon, etc.

Applied Industry

Used for circuit board (PCB) cover film (CVL), flexible board (FPC), soft and hard board(RF), cutting and forming of industrial materials such as PCB boards and thin multilayer boards; camera modules,Fingerprint recognition cutting, ceramic industry, hardware manufacturing of tungsten steel and other metal materials.