PCB laser drilling machine

    Using the effect of the interaction of the laser beam on the material to process high-density PCB micro-holes, not only can achieve better processing quality, but also reflects the advantages of laser drilling speed and accuracy.

     Small hole: 1.00-3.00mm;; Ultra-micro hole: <0.001mm. According to different uses, different apertures need to be punched. Generally speaking, it is to punch holes in the metal. The melting point must not be low, otherwise the material will be slightly melted when the laser touches it up, and the resulting micro-holes will not be effective.

    Laser drilling has temperature. First, it cannot be a material with a low melting point. Second, it cannot be different materials and uses. Different pore diameters are required. The pore diameters of vent and filter are different. The pore diameter ranges from 3.00mm to 0.001mm as small as possible. Lasers can be made. Metal punching is the best, plastics and the like cannot be punched, but small holes can be punched.

    The hole diameter of laser drilling can reach 0.01mm, which is suitable for general metal iron, aluminum, copper, etc., and can also be punched on alloys, such as aluminum alloy, zinc alloy, titanium alloy, etc., and can also be punched on rare metals, but The hole diameter that can be punched by different materials is different, and the punching effect of some materials that are easy to melt is not very good.