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Ultraviolet lasers are the best choice for a variety of PCB materials in many industrial applications
Ultraviolet lasers are the best choice for a variety of PCB materials in many industrial applications, from the most basic circuit boards, circuit wiring, to advanced processes such as pocket-sized embedded chips. The variability of this material makes UV lasers the best choice for a variety of PCB materials in many industrial applications, from the most basic circuit boards, circuit wiring, to advanced processes such as pocket-sized embedded chips.
Ultraviolet lasers work quickly in the production of circuits, and surface patterns can be etched onto the board in minutes. This makes UV lasers the fastest way to produce PCB samples. More and more sample laboratories are equipped with internal UV laser systems.
Depending on the optical instrument verification, the UV laser beam can be 10-20 μm in size, producing flexible circuit traces. The biggest advantage of UV in the production of circuit traces, the circuit traces are extremely small and need to be visible under the microscope.
Ultraviolet laser cutting is an excellent choice for large or small production, and it is also a good choice for PCB disassembly, especially when it is needed on flexible or rigid-flex boards. Disassembly is the removal of a single board from the panel. Considering the increasing flexibility of the material, this disassembly poses a major challenge.
Mechanical disassembly methods such as V-groove cutting and automatic board cutting tend to damage sensitive and slim substrates, causing trouble for electronic professional manufacturing service (EMS) companies to disassemble flexible and rigid-flex circuit boards.
Ultraviolet laser cutting not only eliminates the effects of mechanical stresses generated during the disassembly process of edge processing, deformation and damage to circuit components, but also has less thermal stress effects than other lasers such as CO2 laser cutting.
The reduction in “cutting cushions” saves space, which means that components can be placed closer to the edge of the line, and more lines can be installed on each board, maximizing efficiency for maximum flexibility in flexible line applications. .
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