Introduction to the process characteristics of laser scribing of photovoltaic solar cells

In the production of thin-film photovoltaic equipment, there are usually three scribing processes, which produce different thin film depositions. Laser scribing divides meter-sized solar panels into several narrow photovoltaic
 cells, which are powered and run in series. In thin-film photovoltaic processing, most scribing is completed by laser incidence on the substrate surface of the target film. Therefore, any abnormality on the substrate will
affect the tightness of the laser focus, then affect the laser energy density at the processing site, and finally affect the overall quality of scribing.

Principle of solar cell laser scribing machine: Laser scribing uses a high-energy laser beam to irradiate the surface of the workpiece, causing the irradiated area to partially melt and vaporize, thereby achieving
 the purpose of scribing.

Features of solar cell laser scribing machine:

1) The laser can be focused into a very small spot and can draw very fine lines.

2) Non-contact processing, the silicon wafer has a short action time and action range, the heat-affected zone is small, and it will not be cracked by mechanical stress.

3) The cutting depth is 2 to 3 times larger and controllable, which greatly improves the qualified rate of cutting.

4) It can scribing semiconductor boards coated with a protective layer.

5) The scribing speed is fast, which greatly improves productivity, is suitable for automatic control and reduces production costs.

Application range: Solar cell laser scribing machine is mainly used for scribing and cutting of metal materials and silicon, germanium, gallium arsenide and other semiconductor substrate materials. It can process
solar panels, silicon wafers, ceramic wafers, aluminum foils, etc. The workpieces are fine and beautiful, and the cutting edges are smooth.