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Printed Circuit Board (PCB) Fabrication

| First, the status

Printed circuit boards are the basis of electronic information products. Therefore, the application areas of printed circuit boards cover almost all electronic products, including communications and related equipment, computers and related equipment, consumer electronics, automotive electronics, and aerospace electronics. Driven by the development trend of information and digitalization, the PCB industry has a vast market space and good development prospects. In recent decades, the rapid development of integrated circuit technology and electronic information products has also driven the continuous progress of printed circuit board technology. Printed circuit boards have gradually developed from single-sided to double-sided, multi-layered and flexible. As a new generation of electronic products requires a printed circuit board with higher density and more stable performance, high density and high performance are the future directions for the development of printed circuit board technology. With the development of printed circuit boards in the direction of refinement, the use of lasers in the PCB industry is also increasing.

Circuit Board Field Solutions

| Second, the solution

FPC gold finger open skylight FPC is a printed circuit board made of a flexible substrate and has a pattern with high wiring density, light weight, and thin thickness. FPC is mainly used in mobile phones, notebook computers, PDAs, digital cameras, LCM and other products. It is especially suitable for applications with complicated circuits, high signal processing requirements or special electrical or mechanical performance requirements. The disadvantages of traditional processing methods For FPC cutting, the traditional method of processing is to use open molds, and then mechanical stamping through the mold. This processing method is a contact-type machining method, so it will inevitably have some deficiencies:

● As the circuit density and pitch of FPC products continue to increase, and the profile of FPC graphics becomes more and more complex, this makes it increasingly difficult to make FPC molds. For a typical FPC, it is difficult to make molds and the production cycle becomes longer, which results in a significant increase in processing costs. For highly complex FPCs, this very complicated mold making cannot be realized, so it is necessary to consider More sophisticated methods are used to cut these complex FPCs.

● Due to the insufficiency of machining, the FPC mold produced cannot reach a high precision surface, which restricts the further improvement of the FPC processing accuracy. At present, general mold processing can achieve an accuracy of ±50 μm, and it is very difficult or even impossible to achieve an accuracy of ±20 μm or less.

● As the traditional FPC cutting process is a contact-type machining method, it will inevitably cause processing stress on the FPC and may cause physical damage to the FPC. At the same time, when the covering film is subjected to a windowing operation by means of machining, it is inevitable that burrs and overflows will be generated in the vicinity of the window, and the burrs and the overflowing glue are very good after lamination, lamination, and bonding on the pad. Difficult to remove, directly affect the quality of the coating

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