laser cutting protective film

Flexible circuit boards (FPC) are widely used in electronic products due to their light weight, high wiring density, and thin thickness.

There is a layer of resin film on the surface of FPC, which plays the role of circuit protection and solder mask. laser cutting protective film It is an important part of FPC products.

Because its main component is polyimide (PI), it is also called PI covering film in this field, and it is widely used in precision electronics such as aviation, electronics, and electrical appliances.

At the same time, in the actual production process of FPC, due to the needs of the process, a layer of semi-cured epoxy resin adhesive will be coated on the surface of the PI cover film, and a layer of release paper will be pasted on the surface of the adhesive to protect it. The adhesive is not contaminated, so the PI covering film used for FPC is not just a one-component material, it is at least a composite film containing two chemical materials.

For a long time in the past, the cutting of PI film was mainly realized by traditional die-cutting. This process has problems such as low processing accuracy and high manufacturing cost. As the design of electronic circuits develops toward miniaturization and high-density, traditional die-cutting The method has gradually failed to meet the design requirements.

The use of laser to cut PI cover film not only has high cutting accuracy, but also saves high mold costs, and the product qualification rate is also high, which can greatly reduce production costs and improve product quality.

The laser uses non-contact processing. If the laser light source is selected and the process method is appropriate, it will not cause damage to the processed material such as tensile deformation and crushing caused by die-cutting.

Because the laser's focused spot is only tens of microns, it can realize the processing of high-density circuits and micro-holes. This advantage is catering to the pace of development of circuit design, and it is the most ideal processing tool for PI covering films.