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UV picosecond (FPC board, cover film) fine processing equipment
UV picosecond precision processing equipment is mainly used for cutting and opening FPC/PCB boards, and has outstanding performance in camera modules, fingerprint recognition and other application fields.
It can also process polymer materials such as polyimide, non-metallic materials such as ceramics and quartz, and various metal and alloy materials such as tungsten copper.
18013061176
The ultraviolet picosecond laser cutting machine adopts an ultra short pulse ultraviolet picosecond laser, which has a smaller heat affected area and finer cutting. It is suitable for cutting various circuit boards, PI films, FPC cover films and other film types in the 3C electronics industry.
1. Adopting ultra short pulse ultraviolet picosecond laser has the advantages of high processing efficiency, small heat affected zone, and no need for subsequent auxiliary processing, which can achieve the process of "cold" processing
2. The marble platform X/Y system adopts a linear motor drive system to ensure the precision and stability of high-speed operation of the platform
3. Configure high pixel CCD automatic alignment function to ensure accurate product cutting alignment;
4. Can be configured with a large format far-field mirror to ensure that large format products are not spliced during processing. The maximum single processing size can reach 200 × 200mm
5. Configure high-precision mirrors to ensure product processing accuracy and corner process effect. The repeatability accuracy can reach 1um
Applications
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