Picosecond Cold‑Ablation Laser Cutting for Carbon Fiber Gaskets — Zero‑Delamination High‑Yield Composite Machining

Publish Time: Oct. 21, 2026

Traditional stamping and nanosecond laser cutting easily cause delamination and burrs on carbon fiber gaskets. Chanxan picosecond cold laser achieves clean, high-yield singulation for CFRP compo...

Picosecond Cold‑Ablation Cutting Improves Solder Preform Yield for Semiconductor Packaging

Publish Time: Oct. 20, 2026

Chanxan picosecond cold-ablation laser achieves burr-free singulation for semiconductor solder preform, minimizing heat-affected zone and raising production yield. It replaces traditional stamping f...

Picosecond Laser Cutting for Boron Nitride Sheet Semiconductor Ceramic

Publish Time: Oct. 15, 2026

Chanxan CW-6050PZ picosecond laser performs cold ablation cutting on boron nitride sheet, avoiding delamination and microcracks for semiconductor thermal ceramic. Free sample cutting service ava...

UV Nanosecond Laser Cutting Machine for High-Precision Graphene Thermal Pad Processing

Publish Time: Oct. 14, 2026

Our UV nanosecond laser cutting system delivers burr-free cold cutting for graphene thermal pads, graphite films and flexible thermal conductive films for die-cutting and electronics manufacturers.

UV Nanosecond Lasers for PI Heating Film Precision Cutting

Publish Time: Oct. 13, 2026

Our UV nanosecond laser machine delivers clean, low-heat cutting for PI heating film, enabling precise machining of flexible electronic films without material deformation.

UV Picosecond Laser Cutting: Precision Solution for FPC Flexible PCB Manufacturing

Publish Time: Oct. 13, 2026

This article introduces how UV picosecond laser cutting solves common FPC flexible PCB processing defects, explains core advantages of cold laser processing, key process parameters and extend...

Picosecond Laser vs. Traditional Laser: What's the Difference?

Publish Time: Sep. 29, 2026

An in-depth technical comparison between picosecond (ps) lasers and traditional nanosecond or CW lasers, covering pulse duration, peak intensity, heat diffusion, thermal-affected zones, and applica...

Sapphire and Glass Cutting with Picosecond Lasers: From Smartphones to Wearables

Publish Time: Sep. 28, 2026

Explore how picosecond lasers revolutionize sapphire and glass cutting for smartphones, wearables, and consumer electronics, offering high precision and minimal thermal damage.

Picosecond Lasers in Semiconductor Manufacturing: Cutting, Drilling, and Dicing

Publish Time: Sep. 28, 2026

Discover how picosecond lasers are revolutionizing semiconductor manufacturing through precision cutting, drilling, and dicing of brittle materials like SiC, GaN, and glass with minimal heat-affe...