Laser cutting technology in single crystal germanium windows

Germanium wafer refers to single crystal germanium material with a purity of more than 99.999%, which is one of the most important semiconductor materials in the electronics industry. Due to its excellent characteristics such as high sensitivity, short wavelength, high speed and low noise, germanium wafer is widely used in radio communications, infrared detectors and other fields. In this article, I will discuss the germanium wafer cutting process with you. At present, the commonly used methods for germanium wafer cutting are wire cutting, knife cutting and laser cutting. Next, I will focus on the application of laser cutting process on germanium wafer.

Germanium single crystal wafer is a material with poor thermal properties, so it has high requirements for processing technology. Traditional wire cutting and blade cutting usually cannot achieve high-quality cutting results due to factors such as high heat generation and mechanical stress. However, by choosing the germanium wafer laser cutting machine developed by Chuangxuan Laser, these shortcomings can be effectively avoided. The germanium wafer laser cutting machine, also known as the picosecond laser cutting machine, uses ultraviolet cold light as the energy source for cutting. The equipment adopts a non-contact cutting method with low thermal effect, which effectively avoids scratches on the germanium wafer during the cutting process, and is the preferred equipment for cutting germanium wafers.