Laser grooving is to use a laser to drill holes or grooves on the back of the silicon wafer to penetrate part of the AL2O3 and SiNx film layer to expose the silicon substrate. The back electric field is in contact with the silicon substrate through the holes or grooves in the film.

1.3 Laser processing process

1. Generate conduction band electrons by thermal excitation or light excitation;

2. Conduction band electrons absorb energy through avalanche ionization and Joule heating to form plasma;

3. The plasma transfers energy to the material character through electron-phonon coupling;

4. The character is melted and sublimated by the heated material;

5. The thermal diffusion of the material and the acoustic shock wave cause changes in the surrounding material.

Depanels PCBs With Laser Precision