sun board laser cutting

To make a solar charging board, the first process is slicing, which requires cutting a whole piece of silicon rod into small pieces. This process requires extremely high cutting technology. If burrs or residues appear on the edges, the silicon wafer will be wasted. Therefore, the heat-affected area needs to be reduced during cutting, and the silicon wafer cannot be bent due to heat, so it needs to be heated quickly, followed by rapid cooling.

Compared with traditional mechanical cutting methods, laser cutting of silicon wafers can minimize the impact of cutting, and the processing accuracy is higher, and the use of lasers does not require replacement of consumables, which saves costs in disguise.

For sun board laser cutting, Chanxan CW laser has an industry-leading advantage.

1. The best laser wavelength for cutting solar panels is around 355nm. Chanxan CW ultraviolet laser has a laser wavelength of 354.7nm. According to the actual needs of users, there are 3W~10W power options available to meet the needs of different scenarios.

2. Through Chanxan's unique control technology, the CW series can be adapted to different application scenarios. The all-digital power control technology reduces the cost of learning, and is easy to learn and monitor.

3. The CW series is smaller in size, saving space, customers do not need to enlarge the optical path, the installation is lighter, and the cost performance is extremely high.