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Laser PCB Engraving Machine
USAGE
PCB Laser Marking Machine from Chanxan is designed for bar codes marking, 2D codes and characters, graphics and other information on any kinds of printed circuit board. Integrated with high-performance CO2 / Fiber laser source, import high-pixel CCD camera and micron-level mobile module, PCB Laser Marking Series is competent to pre-marking automatic positioning and post-marking feedback reporting.
18013061176
The Machine CS-0605 series is a valuable tool in the electronics laboratory. The compact laser system produces precise, fine structures for demanding PCBs in a very short time - as single pieces or small series, without masks or tools. Using a special process, the CS-0605 quickly removes large copper areas from laminated substrates such as FR4. The the CS-0605 also delivers excellent results on special materials for RF applications.
The laser wavelength used opens up additional areas of application. The green laser (wavelength 532 nm) reduces the sensitivity to burns of the carrier substrate. The CS-0605 also processes plated-through boards with up to 6 μm strong inhomogeneities. In addition, the CS-0605 can economically cut and drill rigid or flexible substrates up to a thickness of 0.8 mm. Larger substrate thicknesses require more time.
The integrated high-resolution camera quickly and accurately detects register marks or conductor structures on the board.
The intuitive CAM software is pre-installed on the integrated computer. It optimizes CAD data for the laser process and offers comprehensive access to the process parameters. An extensive parameter library for many common and exotic materials supports the operator in his own projects.
The CS-0605 packs smart solutions for operation and maintenance. The system fits on rollers through any laboratory door and makes no further demands on the laboratory apart from compressed air.
Applications
Laser cutting of circuit boards of polyimide2
Laser cutting of circuit boards of polyimide2
Laser cutting of circuit boards of polyimide2
Laser cutting of circuit boards of polyimide2
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