Silicon Wafer Cutting Machine for Semiconductor

The silicon wafers used in fingerprint recognition mobile phones are obtained by UV laser cutting.

The sapphire used in iPhones is cut using a laser process.

The FPC soft and hard board material is used in the fingerprint identification module. When processing these materials, the laser cutting technology can achieve one-time molding, and the speed is very fast, which meets the needs of the market.

Application of laser cutting technology in the manufacture of mobile phone fingerprint modules

Technically, the fingerprint recognition module chip and the camera module have high requirements for cutting precision, with smooth cross-section and less chipping. To achieve such cutting, laser cutting technology is the best choice.

1) The section of the silicon wafer scribed by non-destructive laser is clean and there is no damage point, the main reason is that there is no laser high temperature ablation process in the process of non-destructive scribing;

2) The conventional laser scribing process requires the removal of the silicon material in the dicing track, resulting in a large amount of silicon dust, while the non-destructive laser scribing process produces a very small amount of dust;

3) The temperature control range of the non-destructive laser scribing process is 150-250℃, which is a low temperature process;

4) Compared with positive cells, the strength of non-destructive laser scribing cells remains almost unchanged, while the strength of conventional laser scribing cells decreases by more than 10%.