SIC silicon carbide wafer laser cutting process

The laser cutting process uses a focused laser to process the surface or interior of a workpiece and separate it. Since laser cutting is a non-contact processing process, it avoids the influence of tool wear and mechanical stress, greatly improving the roughness and processing accuracy of the SiC wafer cutting surface. Laser cutting can also reduce the need for subsequent polishing and cutting processes, reduce material damage 
Types of wafers include silicon wafers, LED wafers, and silicon carbide (SiC) wafers. With the continuous development of society, SiC wafers, as a new type of semiconductor device, have been widely used in high temperature, high pressure, and high frequency fields such as electric vehicles, solar inverters, and radar systems. As a broadband material, SiC has a wide bandgap, high mechanical strength, and high heat transfer performance, but it is also a very hard and brittle material, which is difficult to process, especially in the subsequent process. Wafer cutting is a very important part of semiconductor power device manufacturing. The cutting method and cutting quality directly affect the thickness, surface roughness, size, and production cost of the wafer, and have an important impact on the manufacturing of power devices. At present, the cutting process of SiC silicon carbide wafers is mainly divided into two types: diamond blade cutting and laser cutting. The following will introduce the laser cutting process of SiC wafers in detail.

The laser cutting process uses a focused laser to process the surface or interior of a workpiece and separate it. Since laser cutting is a non-contact processing process, it avoids the influence of tool wear and mechanical stress, greatly improving the roughness and processing accuracy of the SiC wafer cutting surface. Laser cutting can also reduce the need for subsequent polishing and cutting processes, reduce material damage and costs, and reduce environmental pollution caused by traditional grinding and polishing processes. Laser cutting technology has long been used in silicon carbide cutting, silicon ingot cutting, and quartz material cutting (mainly used in laser cutting and splitting processes in the field of color filters).