Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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CW-6050Z
Nanosecond Laser Cutting Machine for PCB & FPC Processing
This nanosecond-laser micromachining system delivers high-speed, high-precision processing for PCBs, FPCs, metals, camera modules, ceramics, tungsten steel, PI, and other polymer materials. With ≤ 25 μm accuracy and minimal heat impact, it ensures clean cutting, drilling, and etching.
The system can be configured with nanosecond UV, green or IR laser technology. The appropriate wavelength should be selected according to material absorption, required cutting depth, acceptable heat-affected zone and production speed.
Chanxan nanosecond laser system provides micron-level precision for diverse substrates. Engineered with ±1μm positioning and HD optics, it supports machining thicknesses up to 3 mm, subject to material structure and process requirements. A stable, high-speed solution for rigorous industrial micromachining.
The motion platform provides a stable mechanical foundation, while linear motors and scales support high-speed motion with ±1 μm positioning and repeatability. This combination improves path consistency when processing fine contours, narrow slots and repeated feature patterns. Laser energy, scanning speed, path overlap and multi-pass strategy are adjusted to control the heat-affected zone, edge discoloration, carbonization and material redeposition.
Advanced pulse control limits the heat-affected zone to ≤20μm, ensuring burr-free edges on sensitive polymers and alloys.
Multi-format software support and optional automation maximize throughput for complex industrial production lines.
Visualizing high-quality edge finishes and intricate laser processing results.
Chanxan's high-precision laser systems are engineered for the most demanding production environments.
Precision cutting and drilling of FPC/PCB, PI films, cover films, and camera module components for compact electronic devices.
Fine processing of flexible circuits, copper foils, LCP materials, and thin insulating layers used in communication modules.
Micromachining of silicon wafers, ceramic substrates, thin metal coatings, and packaging materials requiring stable low-heat processing.
Micro-cutting and structuring of stainless steel, titanium, Invar alloy, ceramics, and high-performance polymer materials.
| Features | Parameters |
|---|---|
| Model | CW-6050Z |
| Laser Type | Nanosecond UV/IR/Green |
| Laser Power | 15W |
| Transmission System | X/Y/Z Three Axis |
| Working Area | 600*500mm |
| Machining Thickness | ≤3mm |
| Machining Speed | ≤3000mm/s |
| Overall Machining Accuracy | ≤25um |
| Heat-Affected Zone | ≤20um |
| Positioning | ±1μm |
| Repeatability | ±1μm |
| Software Control System | Chanxan Self-developed |
| Supported Formats | PLT, BMP, DXF, DWG, AI, LAS, etc. |
| Overall Dimension | 1700*1600*2200mm |
| Supply Voltage | 380V ±10%, 50HZ |
Core components engineered for precision, stability, and long-term industrial performance.
Designed for performance, precision, and reliability in industrial environments.
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