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CW-5050PZ/6050IPL
This picosecond laser system is designed for high-precision processing of glass and sapphire components. It is widely used in display panels, instrument panels, wearable devices, and semiconductor applications. Delivering clean edges, minimal chipping, and no taper, the system ensures high-quality results with stable, automated production performance.
Utilizing advanced infrared picosecond laser technology, high-precision glass and sapphire cutting is achieved, ensuring robust edges, high precision, and reliable performance in industrial applications.
Delivers ultra-clean cutting results with chipping ≤20μm, ensuring superior edge quality for high-precision glass components.
Achieves straight, vertical edges without taper, maintaining consistent geometry and dimensional accuracy.
Minimizes heat-affected zones to preserve material integrity, reducing micro-cracks and ensuring high-strength finished parts.
Visualizing high-quality edge finishes and intricate laser processing results.
Chanxan's high-precision laser systems are engineered for the most demanding production environments.
Used for precision processing of smartphone cover glass, wearable device screens, camera windows, and sensor protection components.
Supports micromachining of glass substrates, wafer-level packaging materials, and optical components requiring low thermal impact.
Enables high-precision cutting of optical glass, sapphire windows, and lenses used in advanced optical systems.
Applied in cutting and drilling of OLED, LCD, and touch panel glass, ensuring high edge quality and dimensional consistency.
Used for manufacturing glass panels in measuring instruments, control displays, and high-end industrial interfaces.
Our advanced ultrafast laser processing technology ensures ideal results on a wide range of materials.
| Features | Parameters | |
|---|---|---|
| Model | CW-6050IPL (Dual Station) | CW-5050PZ (Single Station) |
| Laser Type for Cutting | Picosecond IR Laser (70W) | |
| Laser Type for Splitting | CO2 Laser (150W) | |
| Motion System | 2X/2Y/2Z Six-axis System | X/Y/Z Three-axis System |
| Working Area | ≤ 600mm × 800mm | ≤ 500mm × 500mm |
| Machining Thickness | ≤ 3mm | |
| Positioning Accuracy | ± 3μm | |
| Overall Accuracy | ± 15μm | |
| Processing Chipping | ≤ 20μm | |
| Min Hole Diameter | 0.2 - 1.5mm | |
| Software System | Chanxan Self-developed | |
| Structure | Welded Steel + Marble Base | |
| Supply Voltage | AC 380V ±10%, 50HZ | |
| Overall Dimension | 2050(L) * 2700(W) * 1750(H)mm | 1200(L) * 1400(W) * 1665(H)mm |
| Weight | Approx. 4500KG | Approx. 1500KG |
Core components engineered for precision, stability, and long-term industrial performance.
Designed for performance, precision, and reliability in industrial environments.
Subscriber：Single/Dual Station Picosecond Glass Laser Cutting and Splitting Machine
