Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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Ultrafast Laser Processing
Ultra-Fast Femtosecond Laser
High-Precision CCD Vision
Ultra-Fine Beam Quality & Stability
High Pulse Energy
Flexible Micro-Cutting
Proprietary Smart Control
Femtosecond Laser System
Ultra-fast, high-precision micromachining for all materials
Ultrashort Pulse Cold Processing Technology
High-Speed Precision Motion System
High-Resolution CCD Vision Alignment
Stable Optical System with Full-Path Protection
Picosecond Laser System
High-speed precision processing of FPC, PI, and foils.
High Efficiency & Stable Operation
Proven Process Compatibility
Precise Energy Control with Minimal HAZ
Optional Automation for Enhanced Productivity
Nanosecond Laser System
Precision nanosecond laser cutter for PCB & FPC Cutt...
Dual-Head Synchronous Processing
Fully Automated Roll Processing System
Clean Cutting with Minimal Carbonization
High Efficiency with Precision Output
Optimized Optical Energy Distribution
Intelligent Networking & Remote Monitoring
Picosecond Laser Machine with Double Station for Roll-Sheet
High-speed dual-station laser cutting for film rolls
Advanced Picosecond Processing Technology
Premium Optical System Integration
High Accuracy with Superior Edge Quality
Optional Dual-Platform Automation System
Single/Dual Station Picosecond Glass Laser Cutting and Splitting Machine
High-precision glass cutting with minimal chipping
