Adopting high-performance UV laser cold light source,and high precision CCD image positioning technology,laser cutting machine use the independent research and development of visual laser control software, perfectly complete FPC, PCB shape cutting, contour cutting, drilling and superfinishing of composite film window opening.
The machine is used for laser precision cutting of FPC, PCB, hard and soft bonding board, FR4, covering film, ITO, silicon wafer, ceramic and other products.
1. Used for covering film cutting
After the cover film is opened, the edge of the cut cover film is neat and round, smooth and free of burrs and overflows. However ,If use mold and other machining methods to do window opening, may be near the window will exist the burr and overflow left after punching , the burr and overflow of the glue after bonding pressing on the pad is difficult to remove, directly affect the quality of the subsequent coating.
2.Used for FPC/PCB cutting
Only according to the computer dispatched drawing,the machine complete high precision and high speed cutting,making laser cutting surface smooth without burr. At the same time, its production is not limited by processing quantity.For small batch processing services, laser processing is cheaper, helping us to win the market competition in time and cost.
Applicable Fields: precision cutting of electronic materials, semi-cutting of film materials, die-cutting in the electronics industry, high-precision cutting and opening of other non-metallic materials.
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