Germanium Window Laser Scribing Cutting Mobile phone camera sun solar

The glass laser cutting machine uses an ultra-short pulse infrared picosecond laser, which has a smaller heat-affected zone and more precise cutting. It is suitable for cutting various circuit boards in the 3C electronics industry, cutting instrument screens, cutting glass display cover plates, and fine processing of various materials such as PI films and FPC cover films.

1.Using ultra-short pulse infrared picosecond laser, suitable for high-precision cutting of brittle materials such as glass and flexible materials

2.Using marble platform: stable load-bearing, corrosion-resistant;

3.Equipped with linear motor, optical scale, linear motor and optical scale are closed-loop controlled by motion controller, fast speed, no contact between stator and mover during movement, no wear for a long time, basically no maintenance

4.Visual positioning function, greatly improves cutting accuracy, small edge collapse, no dimension.

5.Optional automatic loading and unloading system

Product name: Glass laser cutting machine/glass laser drilling machine

Parameters\Model: CS-5050-UV

Processing area: 500*500mm, customizable

Positioning accuracy: ±3um

Laser power: Infrared picosecond 30W

Processing edge collapse: ≤5um

Processing thickness: ≤6mm

Moving speed: ≤1000mm/s

Supported formats: DSP, PLT, BMP, DXF, DWG, AI, LAS, etc.

Working voltage: 380V±10%, 50HZ/60HZ

Dimensions: 1400*1600*1800mm

Motor stroke:

X:550mm Y:550mm

Weight: about 1.5 tons

It can be widely used in high-precision marking and cutting of germanium windows glass, drilling and cutting of sapphire, marking/drilling/cutting of ceramics, cutting of LCD/OLED display panels, LED wafer dicing and cutting and other processing fields.