Home > Products > Laser Precision Processing
PCB/FPC/Fingerprint Module/Mobile phone camera/Glass/Sapphire
USAGE
Drilling blind holes, via holes in HDI board, blind cut and blind slot in rigid-flex board.
Cutting a variety of FPC and cover layer, low carbonization.
Cutting FPC and copper substrate thickness up to 1 mm, smooth appearance.
Precisely etching of functional film.
Cutting the base material.
13776093768
Applications
copper substrate laser cutting
camerra module laser cutting
fingerprint module laser cutting
FPC laser cutting machine
Subscriber：UV Laser Cutting Machine
