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Solar Cell Scribing Machine
Cutting and scribing germanium and silicon
gallium arsenide, metal and other semiconductor material substrate
machinable aluminum foil,silicon, solar panels, ceramic , etc.
Low operating costs, average trouble-free operation up to 100, 000 hours, high electro-optic conversion efficiency, equipment power below 2KW, save energy consumption for long use.
Powerful software with proprietary intellectual property rights, easy operation.Chanxan infrared laser diode wafer dicing machine is mainly used in single-table glass inactive diode wafer cutting & scribing in semiconductor manufacturing industry.
|XY Grating Ruler Resolution||0.1μm|
|Z Axis Accuracy||±1μm|
|Rotation Axis Accuracy||±20″|
|CCD Positioning Accuracy||1-2μm|
|Repeat Positioning Accuracy||±1μm|
Subscriber：Fiber Laser Scribing Cutting Machine for Solar Cell Polycrystalline Silicon