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UV Laser Drilling Machine for Mico-holes

Silicon Niteride /Quartz Laser Drilling Femtosecond Laser Drilling

Processing target

It is suitable for flexible board (FPC) through holes and blind holes; it can be used for cutting cover film (CVL), flexible board (FPC) and rigid-flex board (RF).


Brief Description
1、Thickness: 0.1-1.2mm
2、Edge breakage size: <0.005mm
3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning
4、Non-contact processing, little damage to the material, high cutting precision.


18013061176

lucky@chanxan.com

  • Product Description
  • Product Characteristics
  • Performance Parameter
  • Application Field

UV Laser Drilling Machine for Mico-holesUV Laser Drilling Machine for Mico-holesUV Laser Drilling Machine for Mico-holesUV Laser Drilling Machine for Mico-holesUV Laser Drilling Machine for Mico-holes

UV Laser Drilling Machine for Mico-holes

UV Laser Drilling Machine for Mico-holes

UV Laser Drilling Machine for Mico-holes


Applications

  • glass laser drilling and cutting

    glass laser drilling and cutting

  • glass laser drilling and cutting

    glass laser drilling and cutting

  • glass laser drilling and cutting

    glass laser drilling and cutting

  • glass laser drilling and cutting

    glass laser drilling and cutting

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