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infinite laser processing on innovative materials
USAGE
The equipment is suitable for FPC board factories. The offline/semi-automatic mode can be selected according to customer needs, through manual loading and unloading or automatic loading and unloading of mechanical arms, and precise positioning of the actual industrial system to realize the control of cover film (CVL), flexible board (FPC), The cutting and forming, window opening and cover opening of rigid bonded boards (RF) and thin multilayer boards can achieve the requirements of no blackening, no carbonized dust, and high precision.
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In laser technology, the shorter the laser pulse, the lower the heat input into the surrounding material. With a picosecond laser, an important hurdle is over-come: there is practically no heat transfer; the targeted material evaporates immediately.
This thermal effect is important for both the cutting and the surface processing of temperature-sensitive materials. The laser offers a very high pulse energy for cutting, for example, ceramic materials such as Al2O3 or GaN without discoloring the materials in the machin-ing process. Thanks to the low heat input, no micro-cracks arise in the material.
Also for surface processing applications such as ablation of transparent thin films or detachment of metal layers on plastic foils, a very stable laser input at a low laser power is required. The machine can easily straddle these diverging requirements. Standard FR4 and laminated HF materials can be processed just as well with this machine.
The high-precision software and the integrated cam-era are supported by the user-friendly Chanxan software. This enables the user to complete projects on challenging materials in the in-house lab in a very short time.
Applications
Subscriber：FR4 Laser Cutting and Depaneling
