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Key Words: PCB DepanelingLaser Marking Medical DeviceCover layer film cuttingHandheld Laser Welder

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UV Laser Wafer Dicing Machine

晶圓紫外雷射切割機

Adopting with high-quality UV as cutting source, the cutting quality and cutting efficiency of chip are much better than traditional blade cutting equipments.

適用材料:矽、玻璃、陶瓷

應用產業

• 半導體業:矽晶圓
• 光電業:LED晶圓
• 3C業:玻璃積體電路載板

產品優勢

• 採用製程優化專利技術
• 無塵專利設計
• 加工無應力
• 適用於薄晶圓


18255564088

lucky@chanxan.com

  • Product Description
  • Product Characteristics
  • Performance Parameter
  • Application Field
UV Laser Scribing Machine Cell Laser Cutting Machine


UV Laser Scribing Machine Cell Laser Cutting Machine

 


UV Laser Scribing Machine Cell Laser Cutting Machine 

Applications

  • Laser dicing silicon wafer

    Laser dicing silicon wafer

  • Laser dicing silicon wafer

    Laser dicing silicon wafer

  • Laser dicing silicon wafer

    Laser dicing silicon wafer

  • Laser dicing silicon wafer

    Laser dicing silicon wafer

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