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晶圓紫外雷射切割機
Adopting with high-quality UV as cutting source, the cutting quality and cutting efficiency of chip are much better than traditional blade cutting equipments.
適用材料:矽、玻璃、陶瓷
應用產業
• 半導體業:矽晶圓
• 光電業:LED晶圓
• 3C業:玻璃積體電路載板
產品優勢
• 採用製程優化專利技術
• 無塵專利設計
• 加工無應力
• 適用於薄晶圓
18255564088
Applications
Laser dicing silicon wafer
Laser dicing silicon wafer
Laser dicing silicon wafer
Laser dicing silicon wafer
Subscriber:UV Laser Wafer Dicing Machine