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【Description】:
Used for high-speed laser etching and stripping of conductive materials on PET films and Glass substrates. Suitable for indium tin oxide (ITO), silver paste (Ag), carbon nanotube (CNT), graphene, nano silver, molybdenum aluminum molybdenum, copper, polymer conductive film, aluminum thin film, PERC, perovskite battery, FTO , TCO and other coating materials ultra-fine linewidth laser etching.
The UV Laser Drilling Machine is used to drilling via holes and blind holes of FPC flexible printed circuit board, and cutting cover layer / FPC flexible printed circuit board /RF rigid-flexible circuit board .
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