Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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CW-6050FZ
Ultra-precision femtosecond laser machine for laser micromachining with near-zero heat impact. Ensures clean edges, micron-level accuracy, and stable performance across a wide range of materials. It combines a 600 × 500 mm XYZ motion platform, CCD-assisted alignment, published ±1 μm positioning and repeatability, and configurable IR, green, or UV laser options.
This femtosecond laser machine supports process development and precision manufacturing on glass, ceramics, sapphire, silicon, metal foils, alloys, and engineering polymers.
Maximize production precision and achieve ideal micromachining results with ultrashort pulse technology. We ensure near-zero heat conduction, eliminating thermal damage and maintaining a minimal heat-affected zone (HAZ) of only 3μm.
Sophisticated CCD vision pre-scanning and automatic target positioning ensure consistent results in complex micro-cutting tasks.
Supports Ultraviolet (UV), Infrared (IR), and Green light configurations to match specific material absorption requirements.
Driven by Chanxan's in-house software, allowing seamless feature upgrades and high-level customization for industrial needs.
Visualizing high-quality edge finishes and intricate laser processing results.
Chanxan's high-precision laser systems are engineered for the most demanding production environments.
Precision micromachining of wafers, chips, and micro-drilling vias, dicing brittle materials like silicon and glass, and modifying thin films with minimal thermal damage.
Ultra-precise micro-machining, such as drilling micro-vias in PCBs, cutting and structuring semiconductor wafers, and processing delicate materials like glass and flexible displays.
High-precision micromachining of components like fuel injectors, sensors, airbags, and battery parts, without heat-affected zones or material deformation.
High-precision processing of components such as stents, catheters, and surgical tools, enabling clean cutting, micro-drilling, and surface structuring of biocompatible materials.
Micro-drilling, fine cutting, and surface structuring of components such as turbine blades, fuel systems, and sensors with minimal thermal impact and high structural integrity.
Advanced microfabrication, materials research, and experimental prototyping; research on ultrafast laser-matter interactions in physics, materials science, and engineering.
Our advanced ultrafast laser processing technology ensures ideal results on a wide range of materials.
| Features / | Parameters / |
|---|---|
| Model | CW-6050FZ |
| Laser Type | Femtosecond UV/IR/Green |
| Laser Power | 10W |
| Transmission System | X/Y/Z Three Axis |
| Working Area | 600*500mm |
| Machining Thickness | ≤1mm |
| Machining Speed | ≤3000mm/s |
| Overall Machining Accuracy | ≤20um |
| Positioning | ±1μm |
| Repeatability | ±1μm |
| Software Control System | Chanxan Self-developed |
| Supported Formats | PLT, BMP, DXF, DWG, AI, LAS, etc. |
| Overall Dimension | 1700*1600*2200mm |
| Supply Voltage | 380V ±10%, 50HZ |
High-quality parts engineered for precision, stability, and long-term industrial performance.
Designed for performance, precision, and reliability in industrial environments.
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