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Ultra-Precision Picosecond Laser Micromachining System

CW-6050PZ

The Chanxan picosecond laser cutting machine is designed for high-precision micromachining across electronics, semiconductor, and biomedical industries. It enables clean cutting, drilling, and etching of FPC, PI films, LCP, and foils with minimal heat impact. 

  • Product Description

Cold Processing
Clean Results

Chanxan picosecond laser system delivers ultrashort pulses for true “cold” processing, minimizing thermal diffusion and HAZ. It ensures high-precision micromachining with clean edges, stable energy output, and consistent performance across a wide range of materials.

Chanxan Picosecond Laser Machine
PRECISION

Ultrashort Pulse

Picosecond laser pulses minimize thermal effects, enabling clean edges without secondary processing.

ACCURACY

High-Speed Motion System

Linear motor drive combined with a marble base ensures stable, precision processing.

STABILITY

CCD Vision Alignment

High-resolution CCD system ensures consistent precision for complex patterns and fine structures.

UNPARALLELED MATERIAL COMPATIBILITY
Various Foil
Non-Metal
Flexible OLED
LCP
PI Film
Nanogold
Polarizer
FPC Cover Films
More Materials
Chanxan Laser - Precision Solutions

Precision Sample Gallery

Visualizing high-quality edge finishes and intricate laser processing results.

Industrial Applications

Chanxan's high-precision laser systems are engineered for the most demanding production environments.

Semiconductor

Used for fine processing of silicon wafers, ceramic substrates, and packaging materials. Suitable for wafer dicing, micro-drilling, and precision structuring of thin films and coatings.

Mobile Devices

Used for precision cutting and drilling of FPC/PCB, camera modules, and display components. Common materials include PI films, cover films, polarizers, and thin metal layers in smartphones and wearable devices.

Medical Device

Enables high-precision cutting and structuring of medical device components such as microfluidic chips, polymer films, and thin metal parts. Common materials include biocompatible polymers, stainless steel, and thin foils for medical instruments.

Communications

Applied in processing flexible circuits, antenna components, and LCP materials for high-frequency communication modules. Enables precise structuring of copper foils and insulating layers used in 5G and RF devices.

Material Compatibility

Our advanced ultrafast laser processing technology ensures ideal results on a wide range of materials.

PCB
           
FPC Flim
           
Wafers
           
Silicon
           
Copper
           
PC Flim
           
PI Flim
           
Glass
           
Ceramics
Technical Specifications - Femtosecond Series
Chanxan Ultra-Precision Series

Technical Specifications

Picosecond Laser Technical Model
Features /Parameters /
ModelCW-6050PZ
Laser TypePicosecond UV/IR/Green
Laser Power30W
Transmission SystemX/Y/Z Three Axis
Working Area500*500mm / 600*900mm
Adsorption Platform Size1200mm*700mm (Customized)
Machining Thickness≤3mm
Machining Speed≤3000mm/s
Overall Machining Accuracy≤30um
Positioning±1μm
Repeatability±1μm
Software Control SystemChanxan Self-developed
Supported FormatsPLT, BMP, DXF, DWG, AI, LAS, etc.
Overall Dimension2100mm*1550mm*1750mm
Supply Voltage380V ±10%, 50HZ

Key Components

Core components engineered for precision, stability, and long-term industrial performance.

CCD Vision
High-resolution vision system enables automatic detection and precise positioning.
Picosecond Laser
Generates ultrashort pulses with high peak power, enabling precision micromachining.
Linear Motors & Marble Base
Ensures stable high-speed movement, vibration suppression, and micron-level positioning accuracy.

Key Features

Designed for performance, precision, and reliability in industrial environments.

1. Ultrashort Pulse Cold Processing
Delivering high efficiency, minimal HAZ, and eliminating the need for secondary post-processing.
2. High-Speed Precision Motion
Ensures exceptional motion accuracy, vibration stability, and reliable performance during high-speed processing.
3. High-Resolution CCD Vision
Ensuring consistent accuracy for complex cutting paths and fine structures.
4. Stable Optical with Full-Path Protection
Guarantee long-term operational stability and consistent beam performance.
Looking for a customized solution for your production line?
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