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CW-6050PZ
The Chanxan picosecond laser cutting machine is designed for high-precision micromachining across electronics, semiconductor, and biomedical industries. It enables clean cutting, drilling, and etching of FPC, PI films, LCP, and foils with minimal heat impact.
Chanxan picosecond laser system delivers ultrashort pulses for true “cold” processing, minimizing thermal diffusion and HAZ. It ensures high-precision micromachining with clean edges, stable energy output, and consistent performance across a wide range of materials.

Picosecond laser pulses minimize thermal effects, enabling clean edges without secondary processing.
Linear motor drive combined with a marble base ensures stable, precision processing.
High-resolution CCD system ensures consistent precision for complex patterns and fine structures.
Visualizing high-quality edge finishes and intricate laser processing results.






Chanxan's high-precision laser systems are engineered for the most demanding production environments.
Used for fine processing of silicon wafers, ceramic substrates, and packaging materials. Suitable for wafer dicing, micro-drilling, and precision structuring of thin films and coatings.
Used for precision cutting and drilling of FPC/PCB, camera modules, and display components. Common materials include PI films, cover films, polarizers, and thin metal layers in smartphones and wearable devices.
Enables high-precision cutting and structuring of medical device components such as microfluidic chips, polymer films, and thin metal parts. Common materials include biocompatible polymers, stainless steel, and thin foils for medical instruments.
Applied in processing flexible circuits, antenna components, and LCP materials for high-frequency communication modules. Enables precise structuring of copper foils and insulating layers used in 5G and RF devices.

| Features / | Parameters / |
|---|---|
| Model | CW-6050PZ |
| Laser Type | Picosecond UV/IR/Green |
| Laser Power | 30W |
| Transmission System | X/Y/Z Three Axis |
| Working Area | 500*500mm / 600*900mm |
| Adsorption Platform Size | 1200mm*700mm (Customized) |
| Machining Thickness | ≤3mm |
| Machining Speed | ≤3000mm/s |
| Overall Machining Accuracy | ≤30um |
| Positioning | ±1μm |
| Repeatability | ±1μm |
| Software Control System | Chanxan Self-developed |
| Supported Formats | PLT, BMP, DXF, DWG, AI, LAS, etc. |
| Overall Dimension | 2100mm*1550mm*1750mm |
| Supply Voltage | 380V ±10%, 50HZ |
Core components engineered for precision, stability, and long-term industrial performance.



Designed for performance, precision, and reliability in industrial environments.
Subscriber:Ultra-Precision Picosecond Laser Micromachining System