Lasers and materials for laser drilling

Fast micro hole drilling

Femtosecond laser drilling, which uses a very high frequency laser to drill holes in materials. Femtosecond is a unit of time, and 1 femtosecond is equal to one trillionth of a second. Compared with traditional laser processing equipment, femtosecond laser has extremely short pulse time, and the object to be processed will not be heated. It is especially suitable for processing lasers below 30 microns. High precision small holes.

Laser micro drilling in Pe

The application of new femtosecond laser technology has just emerged. The main application industries include: semiconductor industry, solar energy industry (especially thin film technology), flat display industry, alloy micro-casting, precise aperture and electrode structure processing, aviation difficult material processing, medical equipment and other fields !

LED illumination in laser drilling

Lasers and laser processing equipment have emerged in high-end 3C manufacturing fields such as consumer electronics touch screen module production and semiconductor wafer dicing, and have shown new application prospects in sapphire processing, curved glass and ceramic production.

OLED laser drilling

As a typical representative of ultra-short pulse laser, femtosecond laser has the characteristics of ultra-short pulse width and ultra-high peak power. Micromachining industry applications.

The application of fingerprint recognition modules on mobile phones has driven the purchase of femtosecond lasers. The steps involved in the laser processing of the fingerprint module include: ① wafer dicing, ② chip cutting, ③ cover plate cutting, ④ FPC soft board shape cutting and drilling, ⑤ laser marking, etc. The main ones are the processing of sapphire/glass cover plates and IC chips. Apple 6 officially started to use fingerprint recognition in 2015, which has also driven the popularity of a number of domestic brands. At present, the penetration rate of fingerprint recognition is less than 50%, so the laser machine used for processing fingerprint recognition modules still has a lot of room for development.

si3n4 laser hole drilling

At the same time, the laser machine can also be used in PCB drilling, wafer dicing and cutting, etc., and the application fields are constantly expanding. Especially with the application of high value-added brittle materials such as sapphire and ceramics in mobile phones in the future, laser processing equipment will become an important part of 3C automation equipment. We believe that in the field of 3C automated processing equipment, femtosecond lasers may play a broad and profound role in the future.