Sapphire Laser Cutting

Laser cutting technology is a high-speed, high-quality cutting method, cutting sapphire wafers not only has the advantages of fast processing speed, good incision quality, but also can cut any pattern.

In order to obtain a better surface quality grade, process parameters such as laser power and cutting speed must be optimized many times.

The following are the main factors that affect the quality of sapphire cutting:

1. Laser power

Laser energy is the main energy source in the process of laser cutting sapphire substrates. Laser power and cutting speed determine the energy input to the sapphire substrate. The size of laser power will have an important impact on cutting. When other process parameters such as cutting speed and auxiliary gas pressure are constant, the kerf width presents a linear proportional relationship with the increase of laser power.

If the laser power is too small, it will not cut through; if the power is increased, the width of the incision will increase, and the roughness of the end face will increase. It is hoped that the laser power will be as large as possible during laser cutting, so that the power advantage of the laser can be fully utilized and the efficiency can be improved.

2. Cutting speed

For cutting sapphire, the laser cutting speed can have a relative adjustment range under the condition that other process parameters remain unchanged.

The cutting speed is small, the width of the incision is large, and the roughness of the incision is large; the cutting speed is large, the width and roughness of the incision are small, and the roughness increases slowly after exceeding the optimal cutting speed. If the cutting speed is too high, the incision will scrape a lot or not cut through; if the cutting speed is too low, the material will be over-burned, and the incision width and heat-affected zone will be large. To improve the cutting quality, the cutting speed should be optimized when other process parameters remain unchanged.

3.auxiliary gas

In addition to the inert gas and reactive gas used to blow away the slag from the cutting area to clear the kerf, the auxiliary gas is used for sapphire material, and the use of nitrogen can play a role in suppressing excessive combustion in the cutting area.

The basic requirement of the auxiliary gas for laser cutting is that the gas flow should be large, so that there is sufficient nitrogen to react exothermically with the cut material, and there is enough power to blow the molten material out of the cut.

During the cutting process, the impurities contained in the nitrogen will adversely affect the cutting quality, so the purity of the nitrogen should be high.

Sapphire, ceramic, metal precision laser cutting machine series

Sapphire, ceramic, metal precision laser cutting machine series cutting machine is to use nanosecond fiber laser to cut sapphire, ceramic and metal, with low price, smooth cutting side wall, minimum edge chipping 10 m, cutting speed faster than traditional cutting tools. quick advantage.

The laser cutting machine developed by Chanxan Laser for sapphire, glass, ceramics and metal cutting not only has the functions of cutting shape, drilling and scribing, but also cutting, drilling and scribing other hard and brittle materials. It has functions such as scribing, fast cutting speed, and the cutting head is available in double or single head. Choosing double cutting head can greatly improve production efficiency.

Features:

Adopt marble precision platform, stable bearing and corrosion resistance.

Using a linear motor with an optical ruler fully closed-loop drive processing platform, easy maintenance, long life and high precision.

Imported high-power laser, with fast processing speed, high stability and long service life.

Imported double head system or self-made single cutting head is optional, and the cutting quality is good.

High negative pressure vacuum machine is used to adsorb products to ensure positioning stability.

Built-in power regulator, safety protection equipment and electrical appliances, stable and reliable.

Equipped with automatic alignment CCD and visual lens, it can accurately identify various Mark points.

The self-developed cutting software is easy to learn and use, and can be customized by customers.