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Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting

Home > News > Industry News

Company News Industry News Exhibition

CO2 vs. UV Laser for Ceramic Substrate Dicing: How to Choose?

Publish Time: Jun. 08, 2026

【Description】：

Compare CO2 thermal melting and UV cold ablation for Alumina & AlN ceramic substrate dicing. Learn how Chanxan Laser optimizes yield, dicing speed, and chipping control.

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