Chanxan Laser to Exhibit at 2026 SIA Shanghai International Semiconductor Technology Exhibition

Chanxan Laser, a professional manufacturer of advanced laser processing systems, will participate in the 2026 SIA Shanghai International Semiconductor Technology Exhibition, one of the leading semiconductor industry events in Asia. The exhibition will be held from June 3–5, 2026 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China.

Driven by rapid advances in AI computing, advanced packaging, chiplet architectures, and automotive electronics, the semiconductor industry in 2026 is accelerating toward higher precision, higher integration, and more complex manufacturing processes. Advanced packaging, wafer-level processing, silicon photonics, and heterogeneous integration are becoming key technology trends, creating growing demand for high-precision laser manufacturing solutions across semiconductor production environments.

Chanxan Laser will showcase its latest high-precision laser systems and intelligent manufacturing solutions for semiconductor, electronics, and advanced material processing applications at Booth E2-A25.

Advanced Laser Solutions for Semiconductor Manufacturing

At the exhibition, Chanxan Laser will present a range of industrial laser systems designed for high-precision and high-efficiency semiconductor manufacturing processes, including:

• · Ultrafast laser micromachining systems

• · Semiconductor wafer processing solutions

• · Precision laser cutting and drilling technologies

• · Laser marking and traceability systems

• · Glass, sapphire, and ceramic material processing solutions

• · 3D 5-axis laser processing platforms

These technologies are widely used in semiconductor packaging, wafer dicing, precision electronics, optical component manufacturing, and brittle material processing applications.

Supporting Next-Generation Semiconductor Production

As semiconductor devices continue toward higher integration, miniaturization, and advanced packaging, precision laser processing is becoming increasingly important in modern semiconductor production environments.

Chanxan Laser focuses on delivering:

• · High-precision processing capability

• · Minimal thermal impact

• · Automated manufacturing compatibility

• · Flexible multi-material processing

• · Stable and efficient production performance

Through continuous innovation in ultrafast laser and intelligent automation technologies, Chanxan Laser supports manufacturers in improving processing quality, production efficiency, and manufacturing consistency.

Visit Chanxan Laser at Booth E2-A25

Chanxan Laser welcomes global customers, industry partners, and semiconductor manufacturers to visit Booth E2-A25 during the exhibition to explore advanced laser manufacturing technologies and discuss future cooperation opportunities.

Exhibition Information

• Event: 2026 SIA Shanghai International Semiconductor Technology Exhibition

• Date: June 3–5, 2026

• Location: Shanghai New International Expo Centre (SNIEC), Shanghai, China

• Booth: E2-A25

For more information about Chanxan Laser and its semiconductor laser processing solutions, visit:
Chanxan Laser Official Website