Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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CXD-1270
Comprehensive solutions for ultrafast laser drilling equipment for various brittle materials such as optical glass, quartz, sapphire, and ceramics; capable of precision processing of micro-holes, irregularly shaped holes, etc., with a wide range of applications.
1. Laser non-contact processing, causing no hard damage to the product.
2. Water-free processing, environmentally friendly and pollution-free, with no consumables.
3. Supports 24/7 operation, with excellent long-term stability.
4. High processing speed, high efficiency, minimal edge chipping, and low power consumption.
| Parameter / Model | CXD-1270 |
|---|---|
| Model | CXD-1270 |
| Laser Type | Solid-State Laser |
| Laser Wavelength | 532 nm |
| Output Power | 60 W |
| Processing Area | 1200 × 700 mm |
| Cutting Speed | Thickness: 1 mm, 40 mm/s (White Glass) |
| Reposition Accuracy | ±0.1 mm |
| Cooling System | Water Cooling |
| Working Voltage | AC 220V ±10%, 50Hz / 60Hz |
| Total Power Consumption | 10 kW |
| Machine Weight | 1000 kg |
| Machine Dimensions (L × W × H) | 1880 × 1660 × 1800 mm |
Comprehensive solutions for ultrafast laser drilling equipment for various brittle materials such as optical glass, quartz, sapphire, and ceramics; capable of precision processing of micro-holes, irregularly shaped holes, etc., with a wide range of applications.
Applications
Subscriber：Solid-State Laser Glass Drilling Machine
