Precision Laser Micromachining Machine | Ultrafast Laser Micromachining Systems
Chanxan provides advanced laser micro processing machines for high-precision cutting, drilling, dicing, grooving, etching and surface structuring of difficult-to-process materials. Our laser micromachining systems are designed for manufacturers that require micron-level accuracy, clean edges, low heat affected zones and stable production performance.
From FPC, PCB, PI film and PET film processing to wafer dicing, glass cutting, ceramic drilling and semiconductor material micromachining, Chanxan offers nanosecond, picosecond and femtosecond laser systems to match different material properties, production speeds and accuracy requirements.
As an experienced industrial laser equipment manufacturer, we support customers with process testing, machine configuration, automation integration and long-term technical service.
Our Laser Micro Processing Machine Series
Nanosecond Laser System for High-Speed Industrial Micromachining
The nanosecond laser system is suitable for high-speed, high-precision processing of PCB, FPC, PI, ceramics, camera modules, metals, polymers and other industrial materials. It offers stable cutting, drilling and etching performance for manufacturers that need efficient micro processing with reliable dimensional consistency.
With micron-level motion control, optimized thermal management and automated system integration, the Nanosecond Laser System is a practical choice for high-volume electronics and precision component production.
Recommended applications:
· PCB and FPC cutting
· Camera module processing
· Ceramic substrate cutting
· PI and polymer material processing
· Thin metal and alloy micromachining
Picosecond Laser System for Clean Cold Processing
The picosecond laser processing machine is designed for materials that are sensitive to heat, carbonization or edge deformation. With ultrashort pulse technology, the system reduces thermal diffusion and helps achieve cleaner edges, smaller heat affected zones and better processing quality.
Chanxan’s Picosecond Laser System is widely used for FPC, PI films, LCP materials, foils, polarizers, flexible OLED materials and precision electronic components.
Recommended applications:
· FPC cover film cutting
· PI film window opening
· LCP material processing
· Thin foil cutting and drilling
· Flexible electronics micromachining
· Semiconductor packaging material processing
Femtosecond Laser System for Ultra-Precision Micro Processing
For high-value materials and extremely strict accuracy requirements, the femtosecond laser micromachining system provides near-zero thermal impact and excellent edge quality. It is suitable for advanced ceramics, sapphire, glass, silicon wafers, medical polymers, high-performance alloys and other difficult materials.
The Femtosecond Laser System is recommended for customers that require ultra-precision laser micro processing with minimal heat conduction, reduced micro-cracking and stable repeatability.
Recommended applications:
· Sapphire and UTG processing
· Silicon wafer micromachining
· Advanced ceramic cutting
· Medical device component processing
· Micro drilling and fine structuring
· High-precision research and production applications
Materials Supported by Chanxan Laser Micro Processing Machines
Chanxan laser micro processing machines support a wide range of industrial materials:
| Material Type | Typical Materials | Processing Capability |
|---|
| Flexible electronics materials | FPC, PCB, PI film, PET film, LCP, coverlay | Cutting, drilling, window opening, contour processing |
| Semiconductor materials | Silicon, SiC, GaN, GaAs, sapphire, ceramic wafers | Dicing, grooving, slotting, micro drilling |
| Glass materials | UTG, display glass, instrument glass, optical glass | Cutting, splitting, drilling, edge processing |
| Ceramic materials | Alumina, zirconia, ceramic substrates | Micro cutting, drilling, structuring |
| Metal and foil materials | Copper foil, aluminum foil, stainless steel, alloy materials | Fine cutting, marking, etching, micro structuring |
| Polymer materials | PET, PI, PC, PP, insulating films, medical polymers | Burr-free cutting, micro perforation, shape processing |
How to Choose the Right Laser Micromachining System
Different laser micro processing machines are suitable for different accuracy levels, material properties and production requirements.
| Laser Type | Best For | Main Advantage |
|---|
| Nanosecond Laser System | PCB, FPC, ceramics, polymers, thin metals | High speed and stable industrial processing |
| Picosecond Laser System | PI film, LCP, foil, glass, wafer and precision electronics | Lower heat impact and cleaner edge quality |
| Femtosecond Laser System | Sapphire, silicon, ceramics, medical materials and advanced materials | Ultra-precision processing with near-zero thermal damage |
If your project involves high-volume production and standard industrial materials, a nanosecond laser micro processing machine may be suitable. If your material is heat-sensitive or requires cleaner edges, a picosecond laser system is usually preferred. For ultra-high precision, brittle materials or high-value components, a femtosecond laser micromachining system offers better control over thermal damage and edge quality.
