Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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CX-2060PZ/PLT
This dual-station picosecond laser machine is designed for fine roll-to-sheet processing of FPC cover films and flexible materials. It enables fully automated production. Dual-head processing doubles throughput while ensuring smooth edges, high precision, and stable performance for electronic material manufacturing.
Picosecond laser processing enables clean cutting, with virtually no carbonization. Dual-head synchronization improves efficiency, while precision motion and CCD positioning ensure consistent accuracy and stable processing of roll materials.
Achieves cutting speeds up to 3000 mm/s with ±5 μm positioning accuracy, ensuring both efficiency and precision.
Integrated automatic feeding, cutting, and receiving enable continuous, unattended operation with improved consistency.
Microprocessing delivers clean cutting and smooth edges with negligible carbonization, improving final product quality.
Visualizing high-quality edge finishes and intricate laser processing results.
Chanxan's high-precision laser systems are engineered for the most demanding production environments.
Processing of FPC cover films and flexible circuits for smartphones, tablets, and wearable devices.
Production of electronic components requiring roll-to-sheet or roll-to-roll processing of thin flexible materials.
Cutting and shaping of flexible films and auxiliary materials used in display modules and touch systems.
Precision converting of FPC auxiliary materials, adhesive films, and functional layers for electronic assembly.
Our advanced ultrafast laser processing technology ensures ideal results on a wide range of materials.
| Features / | Parameters / |
|---|---|
| Model | CX-2060PZ / PLT |
| Laser Type | Nanosecond / Picosecond Selectable |
| Laser Wavelength | 355nm & 532nm |
| Working Size | 270 x 610mm *2 |
| Positioning Accuracy | ± 5μm |
| Processing Speed | ≤ 3000mm/s |
| Base Material | High-precision Marble |
| Scan Range of Galvanometer | 40 x 40mm |
| Splicing Accuracy | ≤ ± 5μm |
| Supported Formats | PLT, BMP, DXF, DWG, AI, LAS, etc. |
| Overall Dimension | 2200 x 1500 x 1750mm |
| Weight | 2000 KG |
| Power Requirement | AC 380V ±10%, 50~60Hz |
Core components engineered for precision, stability, and long-term industrial performance.
Designed for performance, precision, and reliability in industrial environments.
Subscriber：Picosecond Laser Machine with Double Station for Roll-Sheet
