Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
Home > Products > Laser Cutting Machines > Medical Device Laser Cutting
CX-DKJ
High-end market of ultra-fine processing, braided tube punching, medicine bottle punching, surface marking of medicine, cosmetics, polymer material packaging bottles, flexible PCB board marking, dicing, silicon wafer, micro-handle and blind hole processing, LCD glass QR code marking, glassware surface punching, metal surface coating marking plastic buttons, electronic components, git, communication equipment, building materials, etc.
1. Minimal heat-affected zone, preventing deformation, damage, or scorching of processed materials, resulting in a high yield.
2. Wide range of applicable materials, overcoming the shortcomings of currently widely used infrared laser marking processes with unsatisfactory results.
3. High photoelectric conversion efficiency, 355nm output wavelength, resulting in aesthetically pleasing engraving effects, a pleasant tactile feel, and high anti-counterfeiting performance.
4. Widely used in micro-machining and precision engraving of various metal and non-metal film materials.
| Parameter / Model | CX-DKJ |
|---|---|
| Product Name | Medical Braided Tube Drilling Machine |
| Laser Power | 15–30 W |
| Laser Wavelength | 355 nm |
| Laser Type | UV Laser |
| Working Area | 1000 × 100 mm |
| Cooling Method | Water Cooling System |
| Power Supply Requirement | AC 220V ±10%, 50Hz |
High-end ultra-precision laser machining: drilling of braided tubing, drilling of medicine bottles, marking of packaging bottles for pharmaceuticals, cosmetics, and polymer materials, marking and dicing of flexible PCB boards; micro-hole and blind-hole processing of silicon wafers; QR code marking on LCD glass, drilling of glassware surfaces, marking of metal surface coatings, plastic buttons, electronic components, gifts, communication equipment, building materials, etc.
Applications
Subscriber：UV Laser Medical Braided Tube Drilling Machine
