Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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1. High beam quality, small focused spot, minimal heat-affected zone, no thermal effects, and no scorching issues.
2. High-speed engraving, fine and repeatable results; high-precision and meticulous processing ensures perfect engraving results.
3. Long working life, stable laser output, suitable for long-term continuous industrial operation.
4. Energy-saving and environmentally friendly, simple and easy to operate, requiring minimal labor costs; high efficiency and high performance.
| Parameter / Model | CX-N-304 |
|---|---|
| Product Name | UV Laser Auto Interior Cutting Machine |
| Processing Area | 500 × 610 mm, customizable dual worktable (270 × 610 mm) |
| Positioning Accuracy | ±1 μm |
| Laser Type | UV Laser |
| Processing Speed | ≤ 3000 mm/s |
| Processing Accuracy | ≤ 30 μm |
| Focused Spot Size | 20 μm |
| Supported File Formats | DSP, PLT, BMP, DXF, DWG, AI, LAS, etc. |
| Operating Voltage | 380V ±10%, 50Hz / 60Hz |
| Machine Dimensions (L × W × H) | 2200 × 1500 × 1750 mm |
| Galvo Scanning Range | 50 × 50 mm |
| Weight | Approx. 2500 kg |
Subscriber:UV Laser Auto Interior Cutting Machine