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Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting

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Flatbed CO2 Laser Cutting Machine

CW-1325/1630F/2030

The large-format laser cutting machine CW-1325 adopts intelligent typesetting software, and the material usage rate is over 95%;


Imported stepper motor and driver with professionally designed high-speed outer rail;


The frame is thickened, hardened and sturdy. It reduces welding, bends and heats the frame to ensure long-term transportation or use without deformation.


The light path and hardware design is optimized to facilitate dimming and reduce light decay. USB2.0 high-speed data interface, 32-bit high-speed DSP controller to improve overall performance, automatic loading and unloading, greatly reducing labor costs.


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  • Product Characteristics
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  • Application Field

The large-format laser cutting machine CW-1325 adopts intelligent typesetting software, and the material usage rate is over 95%;


Imported stepper motor and driver with professionally designed high-speed outer rail;


The frame is thickened, hardened and sturdy. It reduces welding, bends and heats the frame to ensure long-term transportation or use without deformation.


The light path and hardware design is optimized to facilitate dimming and reduce light decay. USB2.0 high-speed data interface, 32-bit high-speed DSP controller to improve overall performance, automatic loading and unloading, greatly reducing labor costs.


Applications

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