Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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Jul. 2026
Advanced Ceramics Laser Processing & Micro-Drilling
Achieve crack-free cutting and dense via drilling for advan...
Optical & Photonic Laser Processing
Industrial laser equipment for Fused Silica, BK7 & Lit...
Semiconductor Wafer Laser Dicing & Drilling
Boost die yield with Chanxan high-precision wafer laser di...
Precision Laser Cutting and Micro‑Machining of Zirconia Ceramics for Medical & Industrial Applications
Publish Time: Jul. 14, 2026
Boost ZrO₂ processing yield to 97%+. Chanxan's picosecond laser system delivers micro-crack-free, phase-stable cutting for dental, medical & RF components.
Laser Scribing & Dicing Systems for High-Thermal Conductive Aluminum Nitride (AlN)
Overcome hardness and thermal stress in AlN processing. Discover how Chanxan's UV picosecond lasers achieve micro-crack-free, zero-carbonization cuts.
Precision Laser Processing of Alumina (Al₂O₃) Ceramics: Substrate Dicing & Drilling Solutions
Publish Time: Jul. 13, 2026
Chanxan's UV picosecond laser processing system delivers high-precision Alumina (Al₂O₃) ceramic substrate cutting & drilling.
Laser Dicing of Compound Semiconductors (GaAs/InP): Balancing Fragility and Precision
Chanxan picosecond laser dicing machine provides zero-kerf stealth dicing for brittle GaAs & InP wafers. Maximize die strength and optical surface quality for telecom lasers.
Precision Laser Dicing for Glass Wafers and TGV Substrates
Discover Chanxan's picosecond laser wafer dicing machine for advanced packaging glass substrates. Features <3μm HAZ, <5μm kerf, and micro-crack-free TGV processing.
Precision Laser Dicing for GaN-on-Silicon and GaN-on-Sapphire Wafers
Publish Time: Jul. 10, 2026
Chanxan picosecond laser wafer dicing machine delivers <200 nm sidewall damage & 5 μm kerf width for GaN-on-Si & GaN-on-Sapphire.
Laser Dicing Solutions for SiC Wafers: Overcoming High Hardness & Thermal Stress
Explore advanced picosecond laser dicing solutions for silicon carbide (SiC) wafers. Resolve high hardness & mechanical blade dicing limitations.
How to Minimize Edge Chipping in Silicon Wafer Laser Dicing?
Eliminate chipping & micro-cracks with the Chanxan CW-6050PZ picosecond wafer dicing machine. Achieve a <3μm HAZ & narrow scribe streets for silicon, SiC & glass.
Publish Time: Jul. 09, 2026
Achieve crack-free cutting and dense via drilling for advanced ceramics. High-precision laser solutions for Alumina, AlN, Zirconia & LTCC/HTCC substrates.
