Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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Sep. 2026
Chanxan Laser to Showcase Precision Laser Processing Solutions at SENSOR CHINA 2026
Highlighting Femtosecond, Picosecond, and UV Laser Cu...
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Client Case Study: Anti‑Glare Glass Cover Processing with 30W UV Picosecond Laser
A case study detailing how Chanxan Laser replaced hazardo...
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Client Case Studies: Selective Laser Ablation of Multilayer Composite Film
Evaluating selective laser ablation of 4-ply PET/Alumin...
Lasers and materials for laser drilling
Publish Time: Mar. 22, 2022
The application of new femtosecond laser technology has just emerged. The main application industries include: semiconductor industry, solar energy industry (especially thin film technology), flat d...
vision laser engraving machine
Publish Time: Mar. 11, 2022
laser logo on ceramics
Since the laser will have diffuse reflection (close to total reflection) on the ceramic, the absorption of the laser by the ceramic is very poor. How can we make the ceramic absorb the laser to form...
激光 薄膜 切割 軟 板 切割
Publish Time: Mar. 02, 2022
Laser Perforation Machine
Silicon Wafer Cutting for Semiconductors — Inside the Fingerprint Module Manufacturing Process
Discover how Chanxan non-destructive laser scribing achieves low-temperature, burr-free silicon wafer cutting to maximize chip strength and manufacturing yield.
Laser QR Code 2x2mm on PCB
Blank pens for laser engraving
Example of UV laser cutting of FPC flexible board and flexible-rigid board
Publish Time: Feb. 25, 2022