Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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CX-03Z/05Z/10Z/15Z
The UV Laser Marking Machine features advanced 355nm ultraviolet laser technology for ultra-precision marking, engraving, and micromachining with an extremely small heat-affected zone. Ideal for plastics, FPC, glass, silicon wafers, coated metals, and electronic components, it delivers high-contrast, permanent markings without burning, deformation, or material damage. With micron-level precision and excellent anti-counterfeiting performance, it is widely used in electronics, semiconductor processing, medical packaging, cosmetics, and precision manufacturing industries.
Extremely small heat-affected zone, preventing deformation, damage, or scorching of processed materials, resulting in a high yield.
Wide range of applicable materials, overcoming the shortcomings of currently widely used infrared laser marking processes with unsatisfactory results.
High photoelectric conversion efficiency, 355nm output wavelength, producing aesthetically pleasing engravings with a pleasant tactile feel and high anti-counterfeiting properties.
The product is widely used in micromachining and precision engraving of various metal and non-metal film materials.
| Parameter / Model | CX-03Z / 05Z / 10Z / 15Z |
|---|---|
| Working Area | 100 × 100 mm |
| Laser Power | 3W / 5W / 10W / 15W |
| Laser Wavelength | 355 nm |
| Laser Type | Semiconductor 808 nm Pump Source |
| Optical Lens | Full Set of American Laser Optical Lenses |
| Cooling System | Professional Industrial Constant Temperature Cooling System |
| Marking Speed | 500 Characters/s |
| Laser Energy Control | 0–100% Software Adjustable |
| Minimum Character Size | 0.1 mm |
| Minimum Line Width | 0.01 mm |
| Repeat Positioning Accuracy | ±0.001 mm |
| Total Machine Power | 1.5 kW |
| Power Supply | AC 110V / 220V ±10%, 50/60Hz |
| Operating Environment | Temperature: 15°C–30°C; Humidity: 10–90% |
| Machine Dimensions (L × W × H) | 900 × 1000 × 1600 mm |
The UV Laser Marking Machine is designed for ultra-precision marking, scribing, and micromachining, making it ideal for industries requiring minimal thermal damage, high contrast, and micron-level precision.
Consumer Electronics
Mobile phone component marking
Charger and data cable marking
Electronic component engraving
Plastic button laser marking
Communication device identification marking
PCB & Semiconductor Processing
Flexible PCB (FPC) marking and scribing
Micro-hole and blind-hole processing on silicon wafers
Wafer identification marking
Precision QR code marking for electronic traceability
Glass & Display Industry
LCD glass QR code marking
Glass surface micro-drilling
Precision glass engraving
Optical and coated glass marking
Medical & Pharmaceutical Packaging
Medical testing card marking
Pharmaceutical packaging marking
Cosmetic bottle engraving
Anti-counterfeiting coding on polymer packaging
Industrial & Precision Manufacturing
Metal coating marking
Building material marking
Gift and decorative engraving
Precision polymer material marking
Compatible Materials
Plastics and polymer materials
Flexible PCB (FPC) materials
Glass and coated glass
Silicon wafers
Metal surface coatings
Electronic substrates
Packaging films and medical materials
Applications
Subscriber：UV Laser Marking Machine
