Ultra-Thin Glass (UTG) Laser Cutting for Foldable Displays – A Complete Guide

Publish Time: Jul. 31, 2026

A comprehensive guide on Ultra-Thin Glass (UTG) material characteristics, foldable applications, ultrafast laser processing requirements, and Chanxan's Picosecond Laser cutting solution.

Ultrafast Laser Precision Cutting and Marking of Microscope Glass Slides – A Practical Guide

Publish Time: Jul. 29, 2026

Master ultrafast (ps/fs) laser cutting & marking for microscope glass slides. Learn key process parameters for chip-free edges and permanent traceability.

Laser Drilling vs. Mechanical Drilling for Glass Vias – Which Process Is Better for TGV Manufacturing?

Publish Time: Jul. 28, 2026

Comprehensive comparison of laser drilling and mechanical drilling for Through-Glass Via (TGV) fabrication, including capabilities, limitations, and industrial applications.

Picosecond vs. Femtosecond Laser for TGV Glass Drilling – Which One Wins for Industrial Manufacturing?

Publish Time: Jul. 27, 2026

Comprehensive comparison of picosecond and femtosecond ultrafast lasers for industrial TGV drilling, including throughput, quality, cost, and practical production considerations.

Chanxan CO₂ Laser Cutting Machines Successfully Delivered to Korea and Indonesia, Receiving Positive Customer Feedback

Publish Time: Jul. 27, 2026

Chanxan CO₂ laser cutting machines are successfully delivered to Korea and Indonesia, helping customers improve cutting efficiency, quality, and production.

How Does Laser Drilling Create Through‑Glass Vias? Process and Technology Explained

Publish Time: Jul. 27, 2026

Complete technical guide on laser drilling process for Through-Glass Vias (TGVs), covering laser physics, material removal, via formation, and metallisation with practical tuning parameters.

TGV vs. TSV – A Comprehensive Comparison of Through‑Glass Via and Through‑Silicon Via Technologies for Advanced Packaging

Publish Time: Jul. 24, 2026

TGV vs. TSV – A Comprehensive Comparison of Through‑Glass Via and Through‑Silicon Via Technologies for Advanced Packaging

Through‑Glass Via (TGV) Technology – A Complete Guide to Glass Interposer Solutions for Advanced Packaging

Publish Time: Jul. 24, 2026

Comprehensive guide to Through-Glass Via (TGV) technology, comparing TGV vs TSV, glass substrate advantages, process parameters, and UV picosecond laser drilling solutions.

Laser Fiducial Marking for PCB, FPC, Packaging, and Precision Substrates – Principles, Process, and Practical Implementation

Publish Time: Jul. 23, 2026

A technical guide to laser fiducial marking on PCBs, FPCs, semiconductor packaging, glass, and ceramics, covering laser selection, critical parameters, DFM rules, and defect mitigation.