What Is the Maximum Aspect Ratio for High-Precision Laser Hole Drilling in Quartz?

Publish Time: Jun. 10, 2026

In high-precision glass and optical micro-machining, drilling deep micro-vias in fused silica or quartz substrates presents a major physical constraint due to beam clipping and taper formation.

How Can Picosecond Lasers Achieve Burr-Free Scribing on Silicon Wafers?

Publish Time: Jun. 10, 2026

Picosecond lasers achieve absolute burr-free scribing by operating via non-thermal photo-ablation (cold processing). Because the pulse duration is shorter than the material's electron-phonon relaxat...

CO2 vs. UV Laser for Ceramic Substrate Dicing: How to Choose?

Publish Time: Jun. 09, 2026

Compare CO2 thermal melting and UV cold ablation for Alumina & AlN ceramic substrate dicing. Learn how Chanxan Laser optimizes yield, dicing speed, and chipping control.

Why Green Laser Technology Dominates Copper Substrate Cutting in Power Electronics

Publish Time: Jun. 09, 2026

Explore why 532nm green laser technology is the preferred choice for cutting copper substrates in power electronics. Learn about absorption mechanics and Chanxan Laser solutions.

How Do You Avoid Micro-Cracks When Drilling Alumina Ceramics with Lasers?

Publish Time: Jun. 09, 2026

Discover how to eliminate micro-cracks and thermal fractures during laser drilling of Alumina (Al2O3) ceramic substrates. Learn Chanxan's short-pulse & burst mode strategies.

Chanxan Laser to Showcase Ultrafast Picosecond & QCW Systems at CIME 2026 Shenzhen

Publish Time: Jun. 08, 2026

Chanxan Laser (Booth 16T07) will exhibit its advanced Picosecond Laser System and QCW Fiber Laser Cutters at the 16th Shenzhen Heat Conduction Heat Dissipation Materials Expo (CI...

Laser Coverlay Cutting vs Mechanical Die Punching: Cost-Effectiveness Comparison

Publish Time: Jun. 07, 2026

A comprehensive TCO & ROI breakdown for FPC coverlay processing. Learn how Chanxan digital laser cutting eliminates tooling costs ($500-$3,000) and material waste.

What Is the Minimum Kerf Width Achievable in Picosecond FPC Cutting?

Publish Time: Jun. 06, 2026

Using an industrial ultraviolet (UV) picosecond laser micro-machining system, the minimum achievable kerf width in Flexible Printed Circuits (FPCs) is down to 10 to 12 microns (μm). This hy...

How to Prevent Charring and Carbonization When Cutting FPC with Carbon Dioxide Lasers?

Publish Time: Jun. 06, 2026

To prevent carbonization, operators must shift from continuous wave (CW) mode to short-pulse, high-peak-power modulation, utilize high-pressure nitrogen (N2) assist gas (at least 0.6–0.8 MPa), ...