Fused Silica Laser Cutting: Precision Micromachining for Optical Components

Publish Time: Jul. 16, 2026

Discover high-precision fused silica laser cutting and micromachining solutions. Learn how ultrafast lasers eliminate edge chipping and subsurface damage in optical glass manufacturing.

Precision Laser Drilling & Scribing for LTCC/HTCC Multi‑layer Ceramic Substrates

Publish Time: Jul. 15, 2026

High-precision UV & picosecond laser systems for LTCC and HTCC ceramic substrates. Optimize via drilling, cutting, and slotting with zero tool wear.

Laser Machining of Silicon Nitride (Si₃N₄): High‑Speed Cutting and Drilling Solutions

Publish Time: Jul. 15, 2026

High-speed laser cutting & drilling solutions for silicon nitride (Si₃N₄) power modules. Discover Chanxan's picosecond laser machines for AMB substrates with minimal thermal stress.

Precision Laser Cutting and Micro‑Machining of Zirconia Ceramics for Medical & Industrial Applications

Publish Time: Jul. 14, 2026

Boost ZrO₂ processing yield to 97%+. Chanxan's picosecond laser system delivers micro-crack-free, phase-stable cutting for dental, medical & RF components.

Laser Scribing & Dicing Systems for High-Thermal Conductive Aluminum Nitride (AlN)

Publish Time: Jul. 14, 2026

Overcome hardness and thermal stress in AlN processing. Discover how Chanxan's UV picosecond lasers achieve micro-crack-free, zero-carbonization cuts.

Precision Laser Processing of Alumina (Al₂O₃) Ceramics: Substrate Dicing & Drilling Solutions

Publish Time: Jul. 13, 2026

Chanxan's UV picosecond laser processing system delivers high-precision Alumina (Al₂O₃) ceramic substrate cutting & drilling.

Laser Dicing of Compound Semiconductors (GaAs/InP): Balancing Fragility and Precision

Publish Time: Jul. 13, 2026

Chanxan picosecond laser dicing machine provides zero-kerf stealth dicing for brittle GaAs & InP wafers. Maximize die strength and optical surface quality for telecom lasers.

Precision Laser Dicing for Glass Wafers and TGV Substrates

Publish Time: Jul. 13, 2026

Discover Chanxan's picosecond laser wafer dicing machine for advanced packaging glass substrates. Features <3μm HAZ, <5μm kerf, and micro-crack-free TGV processing.

Precision Laser Dicing for GaN-on-Silicon and GaN-on-Sapphire Wafers

Publish Time: Jul. 10, 2026

Chanxan picosecond laser wafer dicing machine delivers <200 nm sidewall damage & 5 μm kerf width for GaN-on-Si & GaN-on-Sapphire.