Laser Machining of Silicon Nitride (Si₃N₄): High‑Speed Cutting and Drilling Solutions

Publish Time: Jul. 15, 2026

High-speed laser cutting & drilling solutions for silicon nitride (Si₃N₄) power modules. Discover Chanxan's picosecond laser machines for AMB substrates with minimal thermal stress.

Precision Laser Cutting and Micro‑Machining of Zirconia Ceramics for Medical & Industrial Applications

Publish Time: Jul. 14, 2026

Boost ZrO₂ processing yield to 97%+. Chanxan's picosecond laser system delivers micro-crack-free, phase-stable cutting for dental, medical & RF components.

Laser Scribing & Dicing Systems for High-Thermal Conductive Aluminum Nitride (AlN)

Publish Time: Jul. 14, 2026

Overcome hardness and thermal stress in AlN processing. Discover how Chanxan's UV picosecond lasers achieve micro-crack-free, zero-carbonization cuts.

Precision Laser Processing of Alumina (Al₂O₃) Ceramics: Substrate Dicing & Drilling Solutions

Publish Time: Jul. 13, 2026

Chanxan's UV picosecond laser processing system delivers high-precision Alumina (Al₂O₃) ceramic substrate cutting & drilling.

Laser Dicing of Compound Semiconductors (GaAs/InP): Balancing Fragility and Precision

Publish Time: Jul. 13, 2026

Chanxan picosecond laser dicing machine provides zero-kerf stealth dicing for brittle GaAs & InP wafers. Maximize die strength and optical surface quality for telecom lasers.

Precision Laser Dicing for Glass Wafers and TGV Substrates

Publish Time: Jul. 13, 2026

Discover Chanxan's picosecond laser wafer dicing machine for advanced packaging glass substrates. Features <3μm HAZ, <5μm kerf, and micro-crack-free TGV processing.

Precision Laser Dicing for GaN-on-Silicon and GaN-on-Sapphire Wafers

Publish Time: Jul. 10, 2026

Chanxan picosecond laser wafer dicing machine delivers <200 nm sidewall damage & 5 μm kerf width for GaN-on-Si & GaN-on-Sapphire.

Laser Dicing Solutions for SiC Wafers: Overcoming High Hardness & Thermal Stress

Publish Time: Jul. 10, 2026

Explore advanced picosecond laser dicing solutions for silicon carbide (SiC) wafers. Resolve high hardness & mechanical blade dicing limitations.

How to Minimize Edge Chipping in Silicon Wafer Laser Dicing?

Publish Time: Jul. 10, 2026

Eliminate chipping & micro-cracks with the Chanxan CW-6050PZ picosecond wafer dicing machine. Achieve a <3μm HAZ & narrow scribe streets for silicon, SiC & glass.