Thermal Deformation in PET Film Laser Cutting: How to Control It

Publish Time: Jun. 26, 2026

Learn how to control thermal deformation, shrinkage, and warping in PET film laser cutting. Explore Chanxan's high-precision laser solutions.

Delamination in Polyimide Laser Cutting: Root Causes and Prevention

Publish Time: Jun. 26, 2026

Learn what causes layer separation and delamination during polyimide laser cutting. Prevent flexible PCB defects with Chanxan's picosecond solutions.

Burr Formation in Flexible PCB Laser Cutting: Causes and Solutions

Publish Time: Jun. 26, 2026

Discover what causes burrs in flexible PCB laser cutting and how to prevent defects. Explore Chanxan's high-precision picosecond & nanosecond laser solutions.

PEN(Polyethylene Naphthalate) Film Laser Cutting Solution for Flex PCB | CO2 & Picosecond Laser Solutions

Publish Time: Jun. 24, 2026

Discover PEN film laser cutting solutions for flex PCB manufacturing, including circuit profiling, coverlay opening, and precision feature processing. Chanxan CO2 and picosecond laser system...

Advanced Flexible Materials: TPU, PEEK & ETFE Laser Processing Challenges

Publish Time: Jun. 23, 2026

Discover advanced flexible PCB laser processing solutions for TPU, PEEK & ETFE polymers. Eliminate carbonization & thermal distortion with Chanxan ultrafast systems.

​Flexible PCB Laser Processing Solutions: A Complete Guide to Materials, Methods, and Applications

Publish Time: Jun. 18, 2026

Flexible PCB (FPC) laser processing has replaced mechanical die cutting and routing as the industry standard for high-density manufacturing. By eliminating burrs, delamination, and tool wear w...

PTFE Laser Cutting & Microvia Drilling | CO2 and Picosecond Laser Solutions

Publish Time: Jun. 17, 2026

Precision cutting and via drilling for PTFE and PTFE-based RF laminates, built around the one fact that makes this material different from almost everything else in this series: pure PTF...

Selective PCB Coating Removal: Precision Laser Rework & FA

Publish Time: Jun. 17, 2026

Selective, substrate-safe removal of conformal coating, solder mask, and encapsulant for rework, test-point access, and failure analysis — without abrasion, solvents, or collateral damage to copper.

Precision Laser Direct-Write (LDW) for ITO Film Patterning

Publish Time: Jun. 17, 2026

Selective removal of a transparent conductive layer that's often thinner than the wavelength of light used to remove it — without scarring the glass, PET, or PI underneath.