Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting
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PCB depaneling, PCB cutting, PCB contour cutting, PCB profiling, PCB slot cutting
The Chanxan nanosecond laser PCB depaneling machine is engineered for high-speed, high-precision singulation of FR4 PCBs, thin rigid boards, FPCs, and rigid-flex circuits. Designed for non-contact PCB separation, it enables clean PCB depaneling, contour cutting, slot cutting, and precision PCB profiling. It is an ideal solution for manufacturers processing complex PCB outlines, thin substrates, edge-near components, and stress-sensitive electronic assemblies.
As PCB assemblies become thinner, more densely populated, and more geometrically complex, depaneling is no longer a simple separation step. The Chanxan nanosecond laser system is designed to solve exactly this challenge. With ≤25 μm machining accuracy, ≤20 μm heat-affected zone, and ±1 μm positioning repeatability, the platform helps manufacturers achieve cleaner singulation, lower board stress, and greater design freedom without the consumable wear, hard tooling delays, or process instability associated with conventional depaneling methods.
Physical force may transfer stress into thin boards and solder joints
Burrs, chipping, and tool-related edge inconsistency may occur
Limited by tooling, router diameter, or punch design
Requires blade, router, or punch maintenance and replacement
New geometry may require tooling changes
Higher risk of board flex, cracking, or component stress
Non-contact cutting with reduced mechanical stress
Clean, stable edge quality with controlled heat input
Excellent flexibility for slots, narrow tabs, and complex contours
No physical cutting tool wear during depaneling
CAD-driven digital processing with fast recipe switching
Better suited for thin PCBs and stress-sensitive assemblies
Chanxan nanosecond laser systems are engineered for high-precision PCB depaneling and flexible circuit processing in demanding electronics manufacturing environments.
Non-contact singulation of FR4 rigid PCBs, thin rigid boards, and multilayer PCB panels. Suitable for outer contour cutting, bridge trimming, internal slotting, aperture formation, and precision board separation.
Precision cutting of FPC, rigid-flex circuits, PI-based flexible boards, and coverlay layers. Ideal for fine contour cutting, connector geometry trimming, coverlay opening, and flexible circuit singulation.
Used for thin PCBs, component-dense boards, and assemblies with edge-near components. Laser depaneling helps reduce mechanical stress and process variation in these high-risk applications.
Processing of camera-related circuit boards, compact PCB modules, display-related flexible films, and precision insulating layers used in miniaturized consumer devices.
Core components engineered for precision, stability, and long-term industrial depaneling performance
A rigid, high-stability base structure designed to suppress vibration and maintain consistent motion accuracy during high-speed PCB cutting and contour processing.
Provides short-pulse laser energy for PCB depaneling, drilling, grooving, slotting, and precision micro-cutting across a wide range of PCB and flexible electronic materials.
Enable high-speed path execution, precise contour following, and stable repeatability for complex board geometries, narrow kerfs, and consistent industrial throughput.
Designed for speed, precision, and production-level reliability in PCB depaneling
Supports fast depaneling of FR4 PCBs, FPCs, and rigid-flex circuits without the tool wear, vibration, and board stress.
Advanced pulse management helps maintain clean cut edges, stable edge quality, and low thermal damage.
Suitable for outer contour cutting, internal slots, micro-apertures, bridge cutting, coverlay trimming, and precision board shaping.
Supports integration to help reduce labor input and improve depaneling efficiency in volume manufacturing.
| Features | Parameters |
|---|---|
| Model | CW-6050Z |
| Laser Type | Nanosecond UV / IR / Green |
| Laser Power | 15W |
| Transmission System | X / Y / Z Three Axis |
| Working Area | 500 × 500 mm / 600 × 900 mm |
| Machining Thickness | ≤ 3 mm |
| Machining Speed | ≤ 3000 mm/s |
| Overall Machining Accuracy | ≤ 25 μm |
| Heat-Affected Zone | ≤ 20 μm |
| Positioning | ±1 μm |
| Repeatability | ±1 μm |
| Software Control System | Chanxan Self-developed |
| Supported Formats | PLT, BMP, DXF, DWG, AI, LAS, etc. |
| Overall Dimension | 1700 × 1600 × 2200 mm |
| Supply Voltage | 380V ±10%, 50HZ |
Empowering global manufacturing with 14+ years of expertise, dual CE & ISO certified quality, over 100 national patents, and a comprehensive Technical Training Service designed for your operational success.
Systematic Training: Comprehensive full-process skill coverage.
Expert Support: Continuous project follow-up by senior engineers.
Multiple Formats: Flexible learning modes to maximize operational efficiency.
Outcome Driven: Empowering clients from "knowing" to "mastering" technology.
24H Fast Response: Technical diagnosis and solutions within 24 hours.
Warranty Policy: 1-year machine warranty with lifetime technical support.
Global Parts Supply: Rapid delivery of original parts via global network.
Lifecycle Care: From installation to long-term maintenance and software upgrades.
In-depth analysis of your specific material and performance requirements.
Precision laser sampling to verify the feasibility of the technical solution.
Bespoke manufacturing under ISO9001 quality management systems.
Final testing, professional wooden packing, and secure global shipment.
We are seeking professional partners to expand our presence in the global industrial laser market. Scale your business with Chanxan's high-end technology and manufacturing strength.
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