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Ultra-Thin Glass Processing | Low-Chipping Laser Micromachining | Drilling & Shaped Cutting
Chanxan thin glass laser cutting and splitting machine is designed for high-precision processing of thin glass, ultra-thin glass, cover glass, panel glass, and sapphire components. Combining picosecond laser cutting with precision glass splitting technology, the system delivers clean edges, low chipping, no taper, and stable dimensional accuracy for fragile transparent materials. It is widely used in consumer electronics, display panels, optical components, wearable devices, semiconductor glass substrates, and other high-value glass applications requiring reliable industrial performance.
Thin glass and ultra-thin glass are increasingly used in smartphones, wearable devices, display panels, optical modules, semiconductor packaging, and precision industrial equipment because of their lightweight structure, transparency, and suitability for compact high-performance products. Typical applications include cover glass, touch panel glass, display glass, sensor protection glass, optical windows, wafer-level packaging glass, and selected sapphire components.
Chanxan thin glass laser cutting and splitting machine is engineered to provide high-precision, low-damage processing for fragile glass materials. Utilizing picosecond infrared laser cutting technology with optional integrated splitting capability, the system supports contour cutting, hole drilling, slotting, shaped cutting, and glass separation with excellent edge quality and stable production performance. It is an ideal solution for manufacturers seeking low chipping, no taper, and reliable automation in thin glass and sapphire processing.
Reduced edge chipping for fragile thin glass and ultra-thin glass materials
Straight, taper-free cutting edges for improved dimensional consistency
Lower thermal impact and reduced crack risk compared with conventional methods
Suitable for contour cutting, slotting, drilling, and internal openings
More flexible than hard tooling for custom glass shapes and frequent design changes
Improves processing quality for brittle transparent materials used in electronics and precision devices
Higher risk of edge chipping and micro-cracks in fragile glass.
Mechanical stress can lead to material breakage.
Limited flexibility for complex shapes and irregular contours.
Hard tooling requires costly and time-consuming changes.
Difficulty in achieving taper-free edges for thin glass.
Higher thermal impact in traditional laser methods.
Precision cutting of finished glass outlines, narrow-edge parts, irregular contours, and shaped glass components for consumer electronics, optical assemblies, and display applications.
Suitable for delicate ultra-thin glass materials requiring low-stress, low-chipping processing and high edge consistency.
Integrated splitting capability enables efficient separation of pre-cut glass structures while maintaining stable edge quality and dimensional consistency in production environments.
High-precision drilling of mounting holes, alignment holes, and selected micro-feature holes in fragile glass materials.
Laser processing of slots, internal windows, local openings, and connector features in thin glass parts requiring accurate geometry and clean contours.
Suitable for selected sapphire components used in wear-resistant covers, optical windows, and high-value transparent parts requiring precision cutting quality.
Visualizing high-quality edge finishes and precision laser processing results for thin glass, ultra-thin glass, panel glass, and sapphire applications.
Used for precision processing of thin glass parts in smartphones, tablets, wearable devices, and other compact consumer products.
smartphone cover glass
wearable device screens
camera window glass
sensor protection glass
decorative and functional glass components
Applied in cutting and shaping of thin glass used in display panels, touch panels, and related panel assemblies.
OLED panel glass
LCD panel glass
touch panel glass
display window glass
panel cover components
Suitable for optical windows, transparent protective components, and selected sapphire or glass parts used in optical systems.
optical window glass
sapphire windows
sensor optical covers
transparent photonic components
Supports precision processing of glass materials used in semiconductor-related structures and advanced packaging applications.
glass substrates
interposer glass
wafer-level packaging glass
precision transparent packaging components
Equipped with high-speed galvanometer scanning and vision-assisted positioning for efficient drilling, shaped cutting, and precise alignment of fragile transparent materials.
Ultrashort pulse picosecond laser enables low-damage glass processing with clean edges, low chipping, and taper-free cutting performance for high-value glass and sapphire parts.
The rigid marble-based motion structure provides excellent stability, vibration resistance, and repeatable micron-level positioning for precision industrial glass processing.
Utilizes high-performance picosecond infrared laser technology for high-precision cutting of thin glass, ultra-thin glass, sapphire, and other transparent brittle materials.
Delivers clean edge performance with chipping controlled to ≤20 μm, supporting demanding applications in display, optics, and consumer electronics.
Produces straight cutting edges with minimal taper, improving dimensional consistency and finished-part quality for thin glass products.
Minimizes heat-affected zones and helps reduce micro-cracks, improving the structural integrity of thin glass and sapphire components.
Supports flexible equipment selection for prototyping, small-batch production, or higher-throughput automated manufacturing.
| Features | Parameters |
|---|---|
| Model | CW-6050IPL (Dual Station) / CW-5050PZ (Single Station) |
| Machine Type | Thin Glass Laser Cutting and Splitting Machine |
| Laser Type for Cutting | Picosecond IR Laser (70W) |
| Laser Type for Splitting | CO₂ Laser (150W) |
| Motion System | 2X / 2Y / 2Z Six-axis System (Dual Station) / X / Y / Z Three-axis System (Single Station) |
| Working Area | ≤ 600 mm × 900 mm / ≤ 500 mm × 500 mm |
| Machining Thickness | ≤ 3 mm |
| Positioning Accuracy | ± 3 μm |
| Overall Accuracy | ± 15 μm |
| Processing Chipping | ≤ 20 μm |
| Min Hole Diameter | 0.2 – 1.5 mm |
| Software System | Chanxan Self-developed |
| Machine Structure | Welded Steel + Marble Base |
| Supply Voltage | AC 380V ±10%, 50Hz |
Empowering global manufacturing with 14+ years of expertise, dual CE & ISO certified quality, over 100 national patents, and a comprehensive Technical Training Service designed for your operational success.
Systematic Training: Comprehensive full-process skill coverage.
Expert Support: Continuous project follow-up by senior engineers.
Multiple Formats: Flexible learning modes to maximize operational efficiency.
Outcome Driven: Empowering clients from "knowing" to "mastering" technology.
24H Fast Response: Technical diagnosis and solutions within 24 hours.
Warranty Policy: 1-year machine warranty with lifetime technical support.
Global Parts Supply: Rapid delivery of original parts via global network.
Lifecycle Care: From installation to long-term maintenance and software upgrades.
In-depth analysis of your specific material and performance requirements.
Precision laser sampling to verify the feasibility of the technical solution.
Bespoke manufacturing under ISO9001 quality management systems.
Final testing, professional wooden packing, and secure global shipment.
We are seeking professional partners to expand our presence in the global industrial laser market. Scale your business with Chanxan's high-end technology and manufacturing strength.
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