Cookie consent by cookie-banner.ca
Cn

Key Words: Silicon Wafer Dicing PCB Depaneling Glass Cutting

Home > Products > Ultrafast Laser Systems

FPC Laser Cutting Machine

FPC Contour Cutting | Coverlay Opening | Micro-Hole Drilling | Rigid-Flex Laser Processing

Chanxan FPC laser cutting machine is designed for precision contour cutting, singulation, coverlay opening, micro-hole drilling, and window processing of flexible printed circuits (FPC), rigid-flex boards, and related multilayer flexible electronic structures. It enables high-accuracy, non-contact laser processing for delicate circuit materials while reducing burrs, edge lifting, mechanical stress, and thermal damage in high-density electronic manufacturing.

  • Product Description
Precision Laser Processing for FPC and Rigid-Flex Manufacturing | Chanxan Laser

Precision Laser Processing for FPC and Rigid-Flex Manufacturing

Flexible printed circuits (FPCs) are widely used in smartphones, wearable devices, automotive electronics, medical devices, camera modules, and other compact electronic assemblies because of their lightweight structure, high wiring density, bendability, and design flexibility. Typical FPC constructions may include polyimide substrates, copper foil layers, coverlay films, adhesive layers, stiffeners, and multilayer laminated structures. 

Chanxan FPC laser cutting machine is engineered to provide high-precision, non-contact processing for flexible circuit manufacturing. It is suitable for contour cutting, singulation, coverlay cutting, micro-hole drilling, stiffener trimming, and local window opening on single-sided, double-sided, multilayer FPC, and rigid-flex structures. With optimized UV or ultrafast laser configurations, the system helps manufacturers improve edge quality, reduce mechanical stress, and achieve stable processing performance for high-value electronic components.

Laser Cutting Advantages

  • Non-contact cutting for delicate flexible circuits

  • Better control for coverlay openings, fine slots, micro-holes, and complex FPC outlines

  • Suitable for multilayer FPC and rigid-flex transition areas

  • No die tooling required for prototypes, small batches, and frequent design revisions

  • Improved consistency for miniaturized and high-density electronic components

  • Better flexibility for customized FPC projects and mixed-model production

Traditional Die Cutting

  • Requires physical dies (molds) for each design.

  • Limited by die complexity and manufacturing constraints.

  • Mechanical pressure can deform sensitive materials.

  • Costly and time-consuming to change designs.

  • Physical contact increases risk of mechanical stress.

  • Higher maintenance costs for sharp tooling.

FPC Laser Processing Capabilities

FPC Contour Cutting

Precision cutting of finished FPC outlines, irregular profiles, narrow-edge parts, and complex geometries for flexible electronic assemblies.

FPC Singulation / Depaneling

Low-stress separation of finished FPC units from panels, suitable for delicate flexible circuits and rigid-flex assemblies where mechanical depaneling may cause damage.

Coverlay Cutting & Opening

Laser opening of coverlay layers for solder pads, contact points, connector areas, and selective exposure zones in flexible circuits.

Micro-Hole Drilling

High-precision drilling of mounting holes, positioning holes, vent holes, and micro-feature openings in FPC materials and laminated structures.

Window Opening & Slot Cutting

Processing of slots, connector openings, camera module windows, sensor windows, and other localized features requiring clean edge quality and dimensional accuracy.

Stiffener Trimming & Local Layer Processing

Suitable for trimming stiffener edges, processing adhesive-backed reinforcement areas, and precision shaping of selected multilayer FPC structures.

FPC Laser Processing Samples

Visualizing clean-edge laser processing results for flexible printed circuit manufacturing, including contour cutting, singulation, coverlay opening, micro-hole drilling, and rigid-flex processing.

FPC Contour Cutting
FPC Contour Cutting
FPC Depaneling
FPC Depaneling / Singulation
Coverlay Opening
Coverlay Opening
Micro-hole Drilling
Micro-hole Drilling

Industries & FPC Parts Requiring Precision Laser Processing

Consumer Electronics

Consumer Electronics

Used in the production of compact flexible circuits for smartphones, tablets, laptops, and portable consumer devices.

  • Smartphone FPCs

  • Display interconnect circuits

  • Charging module FPCs

  • Battery connection flex circuits

  • Compact connector FPC assemblies

Wearables & Smart Devices

Wearables & Smart Devices

Applied in miniaturized flexible electronic components for wearable and portable smart devices requiring tight layout control.

  • Smartwatch flex circuits

  • Smart band interconnects

  • Compact sensor FPCs

  • Charging contact circuits

  • Wearable display flex assemblies

Camera Modules

Camera Modules & Optical Electronics

Suitable for precision cutting and opening of flexible circuits used in camera modules, image sensors, and autofocus units.

  • Camera module FPCs

  • Autofocus flex circuits

  • Image sensor interconnects

  • Lens module connection circuits

  • Optical component flexible connectors

Automotive Electronics

Automotive Electronics

Applied in automotive camera systems, display assemblies, sensors, and compact in-vehicle electronic systems.

  • Automotive camera flex circuits

  • Dashboard display FPCs

  • Sensor connection circuits

  • Control module flexible interconnects

  • Battery-related flexible assemblies

Compatible FPC Materials & Structures

Single-sided FPC
Double-sided FPC
Multilayer FPC
Rigid-flex boards
Polyimide (PI)
Copper foil laminated FPC
Coverlay film
Adhesive layers
PET support films
FR4 stiffeners

Key Components

CCD Vision Alignment

CCD Vision Alignment System

High-resolution vision positioning ensures accurate alignment for contour cutting, coverlay openings, and drilled features in complex FPC layouts.

Picosecond Laser

UV / Picosecond Laser Source

Supports precision energy control for flexible circuit processing, enabling cleaner cuts, reduced thermal impact, and better consistency.

Precision Motion Platform

Precision Motion Platform

Stable motion architecture with high positioning accuracy for narrow contours, micro-features, and repeatable processing.

Key Features

Precision Contour Cutting for Flexible Circuits

Enables clean profile cutting of delicate FPC structures with reduced burrs, improved dimensional consistency, and better adaptability to intricate layouts.

Low-Stress Singulation for Finished FPC Panels

Supports non-contact depaneling of completed FPC products, helping reduce stress damage to flexible circuits and multilayer assemblies.

Accurate Coverlay Opening and Fine Feature Processing

Suitable for solder pad exposure, local openings, micro-holes, and narrow slots in coverlay and multilayer FPC structures.

Flexible Manufacturing Without Die Tooling

Improves efficiency for prototypes, frequent design updates, multiple SKUs, and small-batch electronic manufacturing projects.

Adaptable to Rigid-Flex and Multilayer FPC Structures

Supports precision processing of complex circuit stack-ups where conventional punching or routing may compromise quality or flexibility.

FPC Laser Cutting Machine Specifications (CW-6050PZ)

FeaturesParameters
ModelCW-6050PZ
Laser SourcePicosecond UV / Green / IR
Laser Power30W
Motion SystemX/Y/Z Precision Motion Platform
Working Area500 × 500 mm / 600 × 900 mm
Vacuum Adsorption Table1200 × 700 mm (Customizable)
Recommended Material Thickness≤3 mm
Max Processing Speed≤3000 mm/s
Processing Accuracy≤30 μm
Positioning Accuracy±1 μm
Repeatability±1 μm
Vision AlignmentHigh-resolution CCD
SoftwareChanxan Self-developed Control Software
Supported FormatsPLT, BMP, DXF, DWG, AI, LAS, etc.
Supply Voltage380V ±10%, 50Hz

FPC Laser Cutting FAQ

1. What types of FPC can your laser cutting machine process?
Our FPC laser cutting machine can be configured for single-sided FPC, double-sided FPC, multilayer FPC, rigid-flex boards, and selected coverlay- or stiffener-based flexible circuit structures. The exact processing capability depends on material stack-up, copper thickness, coverlay structure, and required feature size.
2. Can the machine cut multilayer FPC and rigid-flex boards?
Yes. The system can be used for multilayer FPC and rigid-flex circuit processing, including contour cutting, depaneling, local trimming, and selected opening operations. Project evaluation should consider layer structure, total thickness, copper design, and the required edge quality.
3. Is laser cutting suitable for FPC coverlay opening?
Yes. Laser processing is widely used for coverlay cutting and opening in FPC manufacturing, especially for exposing solder pads, contact points, connector regions, and local functional areas that require accurate positioning and clean edges.
4. Can your system drill micro holes in FPC?
Yes. The machine can be configured for precision drilling of mounting holes, positioning holes, vent holes, and selected micro-feature holes in FPC structures, depending on material type, layer construction, and dimensional requirements.
5. What is the difference between UV laser and picosecond laser for FPC processing?
Both can be used in FPC manufacturing, but the optimal choice depends on material stack-up, feature size, heat sensitivity, copper structure, and production goals. UV lasers are widely used for flexible circuit cutting and opening, while picosecond lasers are often selected for more demanding applications requiring finer control and lower thermal impact.
6. Will laser cutting damage copper traces or adhesive layers?
A properly configured laser process is designed to minimize damage to copper traces, coverlay, and adhesive structures. However, the final result depends on material composition, layer thickness, copper layout, and the selected laser source. Sample testing is recommended for process validation.
Chanxan Laser | Professional B2B Service & Support

Committed to Your Success

Empowering global manufacturing with 14+ years of expertise, dual CE & ISO certified quality, over 100 national patents, and a comprehensive Technical Training Service designed for your operational success.

14+Years Expertise
80,000m²Production Hub
10,000+Global Clients
100+National Patents

Technical Training Service

  • Systematic Training: Comprehensive full-process skill coverage.

  • Expert Support: Continuous project follow-up by senior engineers.

  • Multiple Formats: Flexible learning modes to maximize operational efficiency.

  • Outcome Driven: Empowering clients from "knowing" to "mastering" technology.

After-Sales Service System

  • 24H Fast Response: Technical diagnosis and solutions within 24 hours.

  • Warranty Policy: 1-year machine warranty with lifetime technical support.

  • Global Parts Supply: Rapid delivery of original parts via global network.

  • Lifecycle Care: From installation to long-term maintenance and software upgrades.

Cooperation Process
STEP 01

Consultation

In-depth analysis of your specific material and performance requirements.

STEP 02

Free Sampling

Precision laser sampling to verify the feasibility of the technical solution.

STEP 03

Production

Bespoke manufacturing under ISO9001 quality management systems.

STEP 04

Delivery

Final testing, professional wooden packing, and secure global shipment.

Join Our Global Network

We are seeking professional partners to expand our presence in the global industrial laser market. Scale your business with Chanxan's high-end technology and manufacturing strength.

Become an Agent
Factory-Direct Pricing
Technical Team Support
Localized Marketing Leads
Multi-Level CE Compliance
Certified Quality (ISO 9001)
Rapid Spare Parts Supply


Applications

Subscriber:FPC Laser Cutting Machine

Name

Tel

Email

CAPTCHA