Why Green Laser Technology Dominates Copper Substrate Cutting in Power Electronics

Publish Time: Jun. 09, 2026

Explore why 532nm green laser technology is the preferred choice for cutting copper substrates in power electronics. Learn about absorption mechanics and Chanxan Laser solutions.

How Do You Avoid Micro-Cracks When Drilling Alumina Ceramics with Lasers?

Publish Time: Jun. 09, 2026

Discover how to eliminate micro-cracks and thermal fractures during laser drilling of Alumina (Al2O3) ceramic substrates. Learn Chanxan's short-pulse & burst mode strategies.

Chanxan Laser to Showcase Ultrafast Picosecond & QCW Systems at CIME 2026 Shenzhen

Publish Time: Jun. 08, 2026

Chanxan Laser (Booth 16T07) will exhibit its advanced Picosecond Laser System and QCW Fiber Laser Cutters at the 16th Shenzhen Heat Conduction Heat Dissipation Materials Expo (CI...

Laser Coverlay Cutting vs Mechanical Die Punching: Cost-Effectiveness Comparison

Publish Time: Jun. 07, 2026

A comprehensive TCO & ROI breakdown for FPC coverlay processing. Learn how Chanxan digital laser cutting eliminates tooling costs ($500-$3,000) and material waste.

What Is the Minimum Kerf Width Achievable in Picosecond FPC Cutting?

Publish Time: Jun. 06, 2026

Using an industrial ultraviolet (UV) picosecond laser micro-machining system, the minimum achievable kerf width in Flexible Printed Circuits (FPCs) is down to 10 to 12 microns (μm). This hy...

How to Prevent Charring and Carbonization When Cutting FPC with Carbon Dioxide Lasers?

Publish Time: Jun. 06, 2026

To prevent carbonization, operators must shift from continuous wave (CW) mode to short-pulse, high-peak-power modulation, utilize high-pressure nitrogen (N2) assist gas (at least 0.6–0.8 MPa), ...

​Why Is UV Laser Cutting the Industry Standard for Rigid-Flex PCB Depaneling?

Publish Time: Jun. 05, 2026

355nm UV laser cutting is ideal for rigid-flex PCBs, using cold ablation to minimize HAZ, eliminate mechanical stress, and produce burr-free edges. Compared with mechanical cutting, it reduce...

How Ultrafast Lasers Improve Wafer Processing: Picosecond, Femtosecond, and Nanosecond Applications

Publish Time: Jun. 05, 2026

Ultrafast lasers improve wafer manufacturing through precise dicing, slicing, TSV formation, scribing, thin wafer handling, and MEMS fabrication. Picosecond and femtosecond systems reduce hea...

What Is a Nanosecond Laser System? Applications, Benefits, and Manufacturing Value

Publish Time: Jun. 04, 2026

Nanosecond lasers emit short pulses (1–100 ns) for precise material processing. They excel in PCB drilling, ceramic cutting, metal marking, and packaging, balancing speed, cost, and manageable t...