FPC Laser Cutting Guide: Precision Solutions for Flexible PCB Manufacturing

Publish Time: May. 25, 2026

Explore how FPC laser cutting compares with die cutting and routing in flexible PCB manufacturing. Learn how non-contact laser processing improves edge quality, precision, production flexibili...

What Is Wafer Dicing? A Complete Guide to Semiconductor Wafer Cutting

Publish Time: May. 23, 2026

Learn how semiconductor wafer dicing works, compare blade, laser, stealth, and plasma dicing methods, and explore the best solutions for silicon, SiC, GaN, and sapphire wafer cutting. Discover w...

Chanxan Laser Welcomes Delegation from Susong Suzhou Economic & Cultural Promotion Association for Industry Exchange

Publish Time: May. 23, 2026

Chanxan Laser welcomed the Susong Suzhou Economic & Cultural Promotion Association delegation for an on-site visit and industry exchange. The delegation explored the company’s manufacturing ...

How Semiconductor, PCB, and FPC Work Together in Electronics

Publish Time: May. 22, 2026

Explore the relationship between semiconductor, PCB, and FPC manufacturing in modern electronics. Learn how chips, circuit boards, and flexible circuits work together in smartphones, EVs, me...

Laser Processing in PCB and FPC Manufacturing: Key Applications for Precision Electronics

Publish Time: May. 21, 2026

Learn how laser processing is transforming PCB and FPC manufacturing. Explore key applications including PCB laser cutting, FPC laser cutting, laser depaneling, microvia drilling, and co...

Laser Processing in Semiconductor Manufacturing: 5 Key Applications

Publish Time: May. 19, 2026

Explore the 5 key applications of laser processing in semiconductor manufacturing, covering wafer dicing, laser drilling, micromachining, marking, and trimming.

Chanxan Laser to Exhibit at 2026 SIA Shanghai International Semiconductor Technology Exhibition

Publish Time: May. 14, 2026

Chanxan Laser will participate in the 2026 SIA Shanghai International Semiconductor Technology Exhibition at Booth E2-A25. The company will showcase advanced ultrafast laser systems, waf...

Chanxan Laser Provided Laser Engraving Equipment for the Beijing 2022 Winter Olympic Torch

Publish Time: May. 11, 2026

Chanxan Laser served as the laser engraver provider for the Beijing 2022 Winter Olympic and Paralympic torches. By developing asymmetric laser defocusing 3D engraving technology, Chanxan succ...

Ultrafast Laser Solutions for Precision Electronics Manufacturing

Publish Time: May. 07, 2026

Explore how ultrafast laser processing (femtosecond and picosecond lasers) enables precision micromachining, cutting, drilling, and thin film processing in modern electronics manufacturing.