Semiconductor Wafer Laser Dicing & Drilling

Publish Time: Jul. 09, 2026

Boost die yield with Chanxan high-precision wafer laser dicing solutions. Zero-chipping cutting, grooving & micro-drilling for silicon, SiC, GaN & glass wafers.

Laser Processing for Solid-State Battery & New Energy Materials

Publish Time: Jul. 09, 2026

Precision laser cutting, micro-drilling, and structuring for brittle solid-state electrolyte ceramics, ceramic-coated films, and thin glass separators. Request a technical solution.

Sapphire Laser Processing & Cutting Solutions

Publish Time: Jul. 09, 2026

Chanxan ultra-fast laser solutions for sapphire processing. Precision crack-free cutting, micro-hole drilling, and contouring for sapphire wafers, optical lens covers, and LED substrates.

Precision Technical Glass Laser Processing Solution

Publish Time: Jul. 09, 2026

Chanxan provides advanced laser processing solutions for technical glass (UTG, quartz, borosilicate, OLED). Non-contact precision cutting & micro-drilling ensures zero micro-cracks, no therma...

What Is the Most Precise Laser Method for PCB Coating Removal Without Damaging Underlying Copper?

Publish Time: Jul. 07, 2026

Discover how UV picosecond laser systems achieve damage-free PCB coating & solder mask removal with micron-level precision and self-limiting depth control.

Picosecond Laser Direct Writing of Laser-Induced Graphene Electrodes on Polyimide Films

Publish Time: Jul. 07, 2026

Discover how Chanxan picosecond laser systems optimize Laser-Induced Graphene (LIG) fabrication on polyimide film with high conductivity and low thermal damage.

Precision Laser Patterning for ITO Films in Touch Screen Manufacturing

Publish Time: Jul. 06, 2026

Discover how picosecond selective laser ablation achieves invisible ITO film patterning for touch screen manufacturing without PET substrate damage. Optimize your production ROI.

Laser Cutting of LCP (Liquid Crystal Polymer) Films: Challenges and Solutions

Publish Time: Jul. 06, 2026

Discover the challenges of LCP film laser cutting. Learn how ultrashort pulse (USP) lasers eliminate HAZ and carbonization for high-yield FPC production.

Picosecond Laser Cutting for Flexible PCBs: Minimizing HAZ and Carbonization

Publish Time: Jul. 03, 2026

Discover how Chanxan's ultra-precision picosecond laser cutting systems minimize HAZ (<10μm) and eliminate carbonization in flexible PCBs. Achieve the perfect balance of FPC edge quality ...